Corporate Communications

Webinars

Indium Corporation’s InSIDER Series is a free webinar program designed to help you enjoy technical content from any location.
Part II: Step-by-step Guide to minimize voiding, HiP, NWO, and Graping Defects web logo
Part II: Step-by-step Guide to minimize voiding, HiP, NWO, and Graping Defects
October 17, 2023 @ 10AM New York Presenter: Ron Lasky, Ph.D., PE, Senior Technologist
The second part of the Defeating Defects in Electronics Assembly (SMT Process) series will cover the steps to take to minimize voiding, the head-in-pillow defect, non-wet opens and graping defects. As an example, the voiding presentation will cover optimum stencil design, stencil thickness, best reflow profiles, the effect of solder powder size, and other variables. The results of these efforts can reduce voiding from over 40% to less than 10%. More
The second part of the Defeating Defects in Electronics Assembly (SMT Process) series will cover the steps to take to minimize voiding, the head-in-pillow defect, non-wet opens and graping defects. As an example, the voiding presentation will cover optimum stencil design, stencil thickness, best reflow profiles, the effect of solder powder size, and other variables. The results of these efforts can reduce voiding from over 40% to less than 10%. Less
Part III: Strategies to Reduce Tombstoning, Solder Balls and Solder Beading, and Defects in Wave Soldering web logo
Part III: Strategies to Reduce Tombstoning, Solder Balls and Solder Beading, and Defects in Wave Soldering
November 14, 2023 @ 10AM New York Presenter: Ron Lasky, Ph.D., PE, Senior Technologist
The third and last part  of the Defeating Defects in Electronics Assembly (SMT Process) webinar series will cover tombstoning, solder balling and beading, and wave soldering defects such as bridging, shadowing, skipping, blow-holes, and icicles. More

The third and last part of the Defeating Defects in Electronics Assembly (SMT Process) webinar series will cover tombstoning, solder balling and beading, and wave soldering defects such as bridging, shadowing, skipping, blow-holes, and icicles.

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