Corporate Communications

Webinars

Indium Corporation’s InSIDER Series is a free webinar program designed to help you enjoy technical content from any location.
Comparing iNEMI Roadmap Predictions with Outcomes web logo
Comparing iNEMI Roadmap Predictions with Outcomes
August 10, 2021 @ 10AM New York, 7AM San Francisco, 3PM London Presenter: Ron Lasky, Ph.D., PE, Senior Technologist
In this webinar, Dr. Ron Lasky will compare past board assembly roadmaps with actual technological outcomes.  More
In this webinar, Dr. Ron Lasky will compare past board assembly roadmaps with actual technological outcomes. He will examine the progression of predictions across seven significant aspects of board assembly covered in the 1994, 2002, 2007, 2013 and 2017 roadmaps: 1) Conversion Costs, 2) NPI Cycle Time, 3) Component Trends, 4) Solder Paste, 5) Bar Solder, 6) Wave Solder Flux and 7) Die Attach Adhesives. As you will see, the conclusions are mixed: some aspects that the roadmaps covered were very accurate, while others could use improvement. NPI predictions were found to be extremely accurate quantitatively as well as qualitatively. On the opposite end, component trends saw the most discrepancy between the roadmaps’ predictions and actual technological outcomes. Also, maximum I/O density, minimum pitch for area array packages, and chip speed placement were all overestimated markedly, especially in the earlier roadmaps. He will discuss general conclusions on the outline and readability of the board assembly roadmaps. Less
Perfil de Reflujo 101 - Parte I web logo
Perfil de Reflujo 101 - Parte I
August 17, 2021 @ 3PM Central, 4PM New York Presenter: Iván Castellanos, Technical Services Manager
Los defectos de soldadura en SMT pueden surgir de tres áreas principales: diseño, materiales y proceso. Identificar la causa raíz y solucionar estos defectos puede resultar costoso More

Los defectos de soldadura en SMT pueden surgir de tres áreas principales: diseño, materiales y proceso. Identificar la causa raíz y solucionar estos defectos puede resultar costoso. Pueden existir muchas formas de resolver un defecto de proceso y, a menudo, la forma más fácil y menos costosa de resolver algunos de estos defectos de soldadura es optimizando el proceso de reflujo. Pero para comprender cómo optimizar mejor el perfil de reflujo, es crucial comprender los conceptos básicos detrás de los materiales/ingredientes de la soldadura. En las dos sesiones de “Perfil de Reflujo 101,” el presentador Iván Castellanos explicará algunos de los conceptos básicos de la ciencia de los materiales detrás de las pastas de soldadura y cómo este conocimiento se puede utilizar para optimizar el perfil de reflujo para resolver algunos defectos comunes de soldadura.

 

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Perfil de Reflujo 101 - Parte II web logo
Perfil de Reflujo 101 - Parte II
August 19, 2021 @ 3PM Central, 4PM New York Presenter: Iván Castellanos, Technical Services Manager
Los defectos de soldadura en SMT pueden surgir de tres áreas principales: diseño, materiales y proceso. Identificar la causa raíz y solucionar estos defectos puede resultar costoso More
Los defectos de soldadura en SMT pueden surgir de tres áreas principales: diseño, materiales y proceso. Identificar la causa raíz y solucionar estos defectos puede resultar costoso. Pueden existir muchas formas de resolver un defecto de proceso y, a menudo, la forma más fácil y menos costosa de resolver algunos de estos defectos de soldadura es optimizando el proceso de reflujo. Pero para comprender cómo optimizar mejor el perfil de reflujo, es crucial comprender los conceptos básicos detrás de los materiales/ingredientes de la soldadura. En las dos sesiones de “Perfil de Reflujo 101,” el presentador Iván Castellanos explicará algunos de los conceptos básicos de la ciencia de los materiales detrás de las pastas de soldadura y cómo este conocimiento se puede utilizar para optimizar el perfil de reflujo para resolver algunos defectos comunes de soldadura. Less
SiP Printing 101 web logo
SiP Printing 101
August 24, 2021 @ 8AM New York, 1PM London, 8PM Malaysia Presenter: Evan Griffith, Product Specialist for Semiconductor & Adv Assembly Materials
Solder paste printing is a complex process with many seemingly minute parameters which could cause defects in a soldered product and, if left untreated, yield losses and cost increases. More
Solder paste printing is a complex process with many seemingly minute parameters which could cause defects in a soldered product and, if left untreated, yield losses and cost increases. These defects are especially apparent and can happen quite often when printing for System-in-Package (SiP) components, which are smaller and have tighter component gaps than those of standard SMT. In SiP Printing 101, Evan Griffith, product specialist for Semiconductor and Advanced Assembly Materials, will outline the basics of fine-feature solder paste printing – as well as processes related to and affected by printing – and the advancements in printer technology which have simplified the SiP printing process. Griffith will also show data outlining the effects of changing important printing parameters and how Indium Corporation is innovating to meet the challenges of fine-feature printing. Less
SiP Printing 101 web logo
SiP Printing 101
August 25, 2021 @ 5PM San Francisco, 8PM New York Presenter: Evan Griffith, Product Specialist for Semiconductor & Adv Assembly Materials
Solder paste printing is a complex process with many seemingly minute parameters which could cause defects in a soldered product and, if left untreated, yield losses and cost increases. More
Solder paste printing is a complex process with many seemingly minute parameters which could cause defects in a soldered product and, if left untreated, yield losses and cost increases. These defects are especially apparent and can happen quite often when printing for System-in-Package (SiP) components, which are smaller and have tighter component gaps than those of standard SMT. In SiP Printing 101, Evan Griffith, product specialist for Semiconductor and Advanced Assembly Materials, will outline the basics of fine-feature solder paste printing – as well as processes related to and affected by printing – and the advancements in printer technology which have simplified the SiP printing process. Griffith will also show data outlining the effects of changing important printing parameters and how Indium Corporation is innovating to meet the challenges of fine-feature printing. Less

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