InTACK™ Material Technology for Reduced Process Complexity in Power Module Soldering and Sintering Applications
Reliance on complex, costly alignment fixturing is growing as power module designers seek repeatable manufacturing and to achieve high-reliability performance. Flux-free soldering techniques are being deployed widely to meet the increasing requirements for quality, low voiding and cleanliness driven by Automotive/EV use cases. The emergence of sintering materials for SiC module applications are also a key consideration as manufacturers look at opportunities to scale processes and leverage the high-performance properties.
An emerging material technology, InTACK™, can be applied during assembly to provide robust tacking strength and reduce the dependency on customized fixturing. The absence of residue and contamination with InTACK™ make this a viable option for flux-free soldering and sintering applications where cleanliness directly influences reliability performance. Test data is analyzed to evaluate material characteristics for dispensing, tack strength, and post-processing. In addition, case studies are reviewed to demonstrate opportunities for reduced process steps, cycle time, and overall cost of ownership in power module manufacturing.Less