As more and more of the electronics industry moves toward (SMA) Subaquatic Microelectronics Assembly, questions have arisen regarding safety aspects, solder joint quality, and reflow profiling. We believe all 3 of these concerns can be resolved by using NanoFoil®.
Happy April fool’s day!
~Jim
Innovative Metal TIMs for AI/GPU Processors As artificial intelligence (AI) and high-performance computing (HPC) technologies evolve, their computational demands have skyrocketed, leading to a
When people think of advancements in medical technology, things like surgery-assisting robots, AI diagnostics, or neurostimulators – like Neuralink’s ‘Blindsight’ –
It’s no secret that indium and indium-silver solder thermal interface materials (TIMs) show great potential for maximizing thermal performance in high-performance computing (HPC) and AI
