Tim Jensen von Indium Corporation erörtert die Lunkerbildung unter QFN-Bauteilen und erklärt, warum dies eine große Herausforderung in der Branche darstellt, insbesondere für das Wärmeleitpad.
Schlüsselwörter: Voiding, Tim Jensen, QFN Komponenten, Thermal Pad, QFN, Indium Corporation, Indium, LV1000, Flux Coated Preform, Preforms, Tape and reel, Avoid the Void, [email protected]
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