Implementation of 5G is happening fast and design criteria are dynamic! Indium Corporation supplies a full line of products that enable superior reliability and performance for all your packaging needs.
LV1000 Flux Coating for Solder Preforms
- Minimal flux residue
- No electrochemical migration (ECM) impact
- Improves bondline planarity
- Increases joint strength
- No ECM Issues
5G Technical Documents
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Safety Data Sheets
5G Blog Posts
Since pure indium preforms are so soft, making thousands of parts requires different processing and packaging methods than manufacturing just a handful of samples.
New Durafuse™ LT is a novel mixed alloy system designed to combine low temperature reflow with drop-shock performance similar to or better than SAC305.
Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpage and die tilt.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.