The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials.
Indium Corporation most popular ball-attach fluxes include:
- WS-446HF: a no-intentionally-added halogen-free water washable ball-attach flux with an activator system powerful enough to promote wetting on the most demanding substrate metallizations
- WS-575-C-RT: a halogen-compliant, room temperature stable, one-step flux that eliminates the need for pre-fluxing
- WS-3600: a robust, halogen-containing flux that works well under challenging conditions
- NC-585: designed for PGA applications; eliminates issues caused by cleaning while still ensuring good
Ball-Attach Flux Technical Documents
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Safety Data Sheets
Ball-Attach Blog Posts
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The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the final ball-attachment...
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From One Engineer to Another®
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