Wafer Bumping Flux
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Bumping Blog Posts
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some exciting work using InFORM® technology to make more reliable solder joints at a lower...
One-Step OSP BGA Soldering Application
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the final ball-attachment...
Effect of Package and Die Size on Dipping and Pick-up
While in South East Asia last summer, Indium’s technical team and I had a chance to discuss flip-chip dipping processes with a major equipment vendor. One of the topics was device (bumped package or die) “pick-up” out of a flip-chip flux dipping tray, and how different factors affect whether...
For comments or questions about the content on this page, please contact:
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
amackie@indium.com
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