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Wafer Bumping Flux

Home » Products » Flux and Epoxy » Wafer Bumping Flux

  • Wafer Bumping Flux
  • Related
    Technical Documents
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Wafer Bumping Wafer Bumping

Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.

Related Markets and Applications

  • Semiconductor Assembly
  • Die-Attach Applications

Critical Products

  • Wafer Flux WS3401 (US Letter)

    Product Data Sheet

  • Wafer Flux SC 5R (US Letter)

    Product Data Sheet

  • WS-3401

    SDS

  • Wafer Flux 5-SLC

    SDS

  • Wafer Flux SC 5R

    SDS

Equipment Partners

  • Sikama
  • Heller

Wafer Bumping Flux Technical Documents

Whitepapers

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Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter

Authors: Andy C. Mackie PhD, Christopher Nash

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Interconnections for SMT, BGA, and Flip Chip Technologies

Authors: Dr. Ning-Cheng Lee

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Solder Bumping Via Paste Reflow For Area Array Packages

Authors: Dr. Ning-Cheng Lee

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Soldering Technology for Area Array Packages

Authors: Dr. Ning-Cheng Lee

Request This Document

Spin-Coating Waferbumping Fluxes for Semiconductor Assembly: Ensuring Pristine Microbumps in Dimensional Devices

Authors: Andy C. Mackie PhD, Sze Pei Lim

Presentations

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Application Notes

Indium Bump Electroplating of Wafers Using Pulse Plating (A4)
Indium Bump Electroplating of Wafers Using Pulse Plating (US Letter)

Product Data Sheets

Wafer Flux SC 5R (US Letter)
Wafer Flux SC 5R (A4)
Wafer Flux WS3401 (US Letter)

Safety Data Sheets

Wafer Flux 5-SLC
WS-3401
Wafer Flux SC 5R

Solder Bumping Blog Posts

Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I

27 Jul 2015 by Tim Jensen [view bio]

The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some exciting work using InFORM® technology to make more reliable solder joints at a lower...

Read More

One-Step OSP BGA Soldering Application

09 Feb 2014 by Indium Corporation® [view bio]

The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex.  There are several variables that impact the final ball-attachment...

Read More

Effect of Package and Die Size on Dipping and Pick-up

29 Jan 2014 by Dr. Andy Mackie [view bio]

While in South East Asia last summer, Indium’s technical team and I had a chance to discuss flip-chip dipping processes with a major equipment vendor. One of the topics was device (bumped package or die) “pick-up” out of a flip-chip flux dipping tray, and how different factors affect whether...

Read More

View All Blog Posts

For comments or questions about the content on this page, please contact:

Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
amackie@indium.com

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Related to Wafer Bumping Flux

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  • Semiconductor Assembly
  • Die-Attach Applications

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