Webinar
Every Degree Matters: Solder TIMs for Lidded Package Designs (TIM1)
Save your spot to unlock the true potential of AI, Gaming and High Performance Computing. Join us on Wednesday, Oct 29, 2025, 2:00 PM – 3:00 PM EST.
For today’s high-power semiconductor packages, heat is the enemy.
For design, process or NPI engineers looking to integrate high-performance thermal interface materials into your LGA, BGA or other chip-level assembly, this webinar will explore how solder TIMs continue to deliver exceptional thermal and mechanical performance in lidded packages (TIM1) and how Indium Corporation’s team of product specialists and experts can help lessen the learning curve from design to production.
In this webinar you’ll learn:
Overview of TIM1 assembly (Die to Lid/Integrated Heat Spreader)
Process integration & design considerations for solder TIMs on a TIM1 assembly
Keys to Success – Critical Metrics for a successful TIM1 solder joint
Inspection, Characterization and Reliability
Assessment Methodology
Indium Supply Chain and Metals’ Availability
Featured Speaker
Kyle Aserian
Applications Development Engineer, ESM
Heat Is the Enemy.
sTIMs Are the Solution.
Indium Corporation is your guide.
As the world’s first innovator of sTIM solutions, Indium Corporation brings its 90+ years of materials science expertise to work directly with you. Our team of application engineers and metallurgists will assist in integrating sTIMs into your process.
High Performance
Our sTIMs deliver the lowest total thermal resistance with minimal voiding.
Reliable
We’ll help you design and adopt a package solution that ensures both improved thermal performance and thermo-mechanical reliability.
Manufactured Globally
Our manufacturing capabilities ensure high-quality product availability at scale across the globe.
Sustainable
We source our materials reliably and responsibly and offer reclaim and recycle programs.
Webinar
Every Degree Matters: Solder TIMs for Lidded Package Designs (TIM1)
Save your spot to unlock the true potential of AI, Gaming and High Performance Computing. Join us on Wednesday, Oct 29, 2025, 2:00 PM – 3:00 PM EST.