Indium Corporation's Tim Jensen discusses voiding under QFN components, and how it is a significant challenge in the industry, especially for the thermal pad.
Keywords: Voiding, Tim Jensen, QFN Components, Thermal Pad, QFN, Indium Corporation, Indium, LV1000, Flux Coated Preform, Preforms, Tape and reel, Avoid the Void, [email protected]
Innovative Metal TIMs for AI/GPU Processors As artificial intelligence (AI) and high-performance computing (HPC) technologies evolve, their computational demands have skyrocketed, leading to a
When people think of advancements in medical technology, things like surgery-assisting robots, AI diagnostics, or neurostimulators – like Neuralink’s ‘Blindsight’ –
It’s no secret that indium and indium-silver solder thermal interface materials (TIMs) show great potential for maximizing thermal performance in high-performance computing (HPC) and AI
