News Releases

Recent News and Press Releases

Posted on 16 Jul 2019

Elements of Indium by Indium Corporation: Malleability

In celebration of Indium Corporation’s 85^thanniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49^thelement. Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with… Read Full Article

Posted on 9 Jul 2019

Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019

Indium Corporation will help customers Avoid the Void^® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process conditions, this solder… Read Full Article

Posted on 27 Jun 2019

Indium Corporation to Host Reliability Symposium at SMTA Dallas

Kim Flanagan

Indium Corporation, in cooperation with industry partners MicroCare and Weller, is hosting a half-day, reliability-focused technical symposium at SMTA Dallas on July 24 in Richardson, Texas. The SMTA Dallas Reliability Symposium is the most recent in a series of technical symposiums hosted by Surface Mount Technology Association (SMTA). The event brings together global leaders to discuss best-in-class processes… Read Full Article

Posted on 25 Jun 2019

Indium Corporation Introduces Non-Silicone-Based TIM for Burn-in and Test

Indium Corporation has added to its line of thermal interface materials (TIMs) with the introduction of HSMF-OS, a non-silicone based metal/polymer material designed for burn-in and test applications. HSMF-OS is designed for high insertion capability. Its high tensile strength and soft compliant polymer backing allow it to survive multiple insertions. HSMF-OS… Read Full Article

Posted on 20 Jun 2019

Indium Corporation’s Vareha-Walsh Shared Insights at Argus US Specialty Metals Conference

Donna Vareha-Walsh

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry expertise at the June Argus US Specialty Metals conference in Chicago, Illinois, USA. Vareha-Walsh presented Assessing the Minor Metals Market for Small Electronics, which included discussion on global supply and demand trends for indium. She also identified the driving forces behind price control… Read Full Article

Posted on 20 Jun 2019

Indium Corporation Expert to Present at SMTA Upper Midwest Expo & Tech Forum

Dave Sbiroli

Indium Corporation’s Dave Sbiroli, Technical Support Manager, will share his industry insight at the SMTA Upper Midwest Expo & Tech Forum, June 27, Minneapolis, Minnesota, USA. Sbiroli will present Impact of Storage Conditions on the Integrity of a No-Clean Solder Paste. As solder paste is being engineered to endure longer storage periods, it… Read Full Article

Posted on 19 Jun 2019

Chinese (Simplified)

Indium Corporation Expert to Present at CEIA Huizhou Seminar

Seven Liang

Indium Corporation’s Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the CEIA Huizhou Seminar on June 27 in Huizhou, China. Liang’s presentation, How to Optimize SMT Processes to Reduce Voiding and Solder Beading, will explore techniques to mitigate these common electronics assembly defects, such as LED voiding and the… Read Full Article

Posted on 19 Jun 2019

Chinese (Simplified)

Indium Corporation Expert to Present at IPC WorksAsia

Pony Liao

Indium Corporation expert Pony Liao, Area Technical Manager, Northern China will share his technical expertise at IPC WorksAsia Automotive Electronics High-Reliability Conference, June 25, Shenyang, China. Liao will present Soldering Material and Stability in Automotive Electronics. Unlike consumer electronics products, automotive electronics place higher demands on soldering material, including chemical stability, durability, and low- or ultra-low voiding. Liao’s… Read Full Article

Posted on 18 Jun 2019

Indium Corporation to Feature AuSn Solder Preforms at HiTEN 2019

Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the International Conference and Exhibition on High Temperature Electronics Network (HiTEN), July 8-10, Oxford, United Kingdom. Indium Corporation’s high-temperature AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. The semiconductor-grade AuSn preforms are designed to meet industry… Read Full Article

Posted on 13 Jun 2019

Indium Corporation Expert to Present at HiTEN 2019

Bernard Leavitt

Indium Corporation’s Bernard Leavitt, Senior Product Specialist, High-Temperature Engineered Solders,will present at the International Conference and Exhibition on High Temperature Electronics Network (HiTEN), July 8-10, Oxford, United Kingdom. Leavitt will present The Impact of AuSn Preforms’ Thickness on Solder Joint Reliability, which discusses how to overcome the diminishing power of semiconductor lasers as their… Read Full Article

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