News Releases

Recent News and Press Releases

Posted on 12 Nov 2019

Indium Corporation Announces Strategic Partnership with Mycronic

Indium Corporation, a premium materials manufacturer and supplier of electronics assembly materials, and Mycronic, a global leader in dispensing and jet printing equipment, have formed a strategic partnership for the development of no-clean and water soluble solder pastes for jetting applications. The partnership with Mycronic will expand Indium Corporation’s portfolio of proven products designed… Read Full Article

Posted on 12 Nov 2019

Indium Corporation Expert to Present at SMTA Indiana Indesign Symposium

Claire Hotvedt

Indium Corporation’s Claire Hotvedt, Product Development Specialist, will present at the SMTA Indiana Indesign Product Engineering and Development LCC Symposium,November 19, Indianapolis, Indiana, USA. Solder alloy development is a balancing act between desirable and undesirable properties. Hotvedt’s presentation, Durafuse^TM LT: Developing a Mixed-Alloy Process for Property Fusion, will demonstrate the possibility of combining alloy… Read Full Article

Posted on 8 Nov 2019

Indium Corporation’s Industry Partners to Feature ‘Live@Productronica’ Demonstrations

Indium Corporation’s industry partners will feature its proven products live on the show floor during Productronica from November 12-15, in Munich, Germany as part of the company’s “Live@Productronica” program. Live@Productronica benefits all participants, including Indium Corporation, its industry partners, and, most importantly, customers, through live product demonstrations on the show floor. These events… Read Full Article

Posted on 7 Nov 2019

Indium Corporation to Feature InFORMS® Reinforced Solder Preforms at Productronica

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS^®, at Productronica, November 12-15, Munich, Germany. Indium Corporation is redefining solder with its InFORMS^® solder preforms and patent-pending solder ribbon. InFORMS^® are a composite solder material with a reinforcing matrix. This results in: Improved mechanical and thermal reliability Uniform bondline thickness Low-voiding performance InFORMS^® do more… Read Full Article

Posted on 6 Nov 2019

Indium Corporation to Feature Innovative New Low-Temperature Alloy Technology at Productronica

Indium Corporation will feature its new high-performance, high-reliability low-temperature alloy technology at Productronica, November 12-15, Munich, Germany. Durafuse^TM LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock… Read Full Article

Posted on 5 Nov 2019

Indium Corporation Expert to Present at EPTC

Kenneth Thum

Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present at IEEE EPTC Singapore 2019, December 4-6, in Singapore. The development of heterogeneous integration, which packs more dies or components into smaller footprints, requires multiple technological advancements in various aspects of advanced packaging. Thum will present Soldering Material Evolution for Heterogeneous Integration, which outlines trends in… Read Full Article

Posted on 4 Nov 2019

Indium Corporation Highlights Company’s 85 Years of Innovation at Productronica

Indium Corporation will continue to celebrate its 85^th anniversary by featuring some of its industry-leading and newest alloys at Productronica, November 12-15, in Munich, Germany. Since its founding, Indium Corporation has continued to research and develop new solutions for common industry issues of the day, while anticipating the industry’s future needs and challenges.… Read Full Article

Posted on 31 Oct 2019

Indium Corporation Launches New No-Clean, Halogen-Free Flux

Indium Corporation has released TACFlux^® 108HF, a new no-clean, halogen-free, high tack force flux for hand soldering and rework applications. TACFlux^® 108HF is compatible with SAC Pb-free alloys for PCB assembly applications. It joins Indium Corporation’s versatile offering of specialty fluxes designed to provide solutions for current and evolving industry challenges. Benefits include: … Read Full Article

Posted on 30 Oct 2019

Indium Corporation Features Indium8.9HF Solder Paste Series at CEIA Xiamen

Indium Corporation will show customers how to Avoid the Void^® with its void-reducing Indium8.9HF Solder Paste series at CEIA Xiamen on November 7 in Xiamen, China. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process conditions,… Read Full Article

Posted on 30 Oct 2019

Indium Corporation’s Vareha-Walsh Shared Insights at International Lead and Zinc Study Group Conference

Donna Vareha-Walsh

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry expertise at the International Lead and Zinc Study Group conference, October 23-25, in Lisbon, Portugal. Vareha-Walsh presented Byproducts of Lead and Zinc Mining – Trends in the Indium Market, which examined indium metal as a byproduct of zinc, and included a market update for… Read Full Article

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