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Recent News and Press Releases

Posted on 13 Jun 2019

Indium Corporation Expert to Present at HiTEN 2019

Bernard Leavitt

Indium Corporation’s Bernard Leavitt, Senior Product Specialist, High-Temperature Engineered Solders,will present at the International Conference and Exhibition on High Temperature Electronics Network (HiTEN), July 8-10, Oxford, United Kingdom. Leavitt will present The Impact of AuSn Preforms’ Thickness on Solder Joint Reliability, which discusses how to overcome the diminishing power of semiconductor lasers as their… Read Full Article

Posted on 12 Jun 2019

Local Companies Host Intern Networking Event

Indium Corporation, CONMED Corporation, Utica National Insurance Group, and Assured Information Security (AIS) joined together to co-sponsor the first annual "Utica Starts with U" intern networking event. Interns from all four companies were invited to attend the event that was held Tuesday at the thINCubator, which encourages the training and retention of talented young… Read Full Article

Posted on 11 Jun 2019

Chinese (Simplified)

Indium Corporation Launches New Low-Temperature Solder Paste

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys. Indium 5.7LT-1 is engineered with a balanced set of properties for outstanding printing and… Read Full Article

Posted on 11 Jun 2019

Chinese (Simplified)

Indium Corporation Experts to Present at High-Reliability Applications and SiP Seminar

Wisdom Qu

Indium Corporation experts will share their technical expertise at a seminar for Manufacturing and Processes for High-Reliability and System-in-Package Applications on June 14 in Suzhou, China. Wisdom Qu, Technical Manager for Eastern China, will present 01005/008004 Components Assembly Challenge.As the explosive growth of the Internet of Things (IoT) continues, so does the need for smaller… Read Full Article

Posted on 6 Jun 2019

Elements of Indium by Indium Corporation: Low Melting Point

In celebration of Indium Corporation's 85^thanniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49^thelement. Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with… Read Full Article

Posted on 4 Jun 2019

Indium Corporation to Feature Solder Paste for HIA, SiP at IMAPS Advanced SiP

Indium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California. Indium Corporation’s Indium3.2HF Solder Paste meets current and evolving challenges encountered in fine-pitch Heterogeneous Integration and SiP applications. Indium3.2HF delivers: Consistent… Read Full Article

Posted on 30 May 2019

Indium Corporation Experts to Present at ICEET

Ed Briggs

Indium Corporation experts will share their knowledge at the International Conference for Electronics Enabling Technologies (ICEET), June 4-6, Markham, Ontario. Ed Briggs, Northeast Regional Sales Manager, will present Electrical Reliability for Automotive Assembly. He will discuss how the increasing amount of electronics in vehicles has escalated demands on automotive electrical systems in an industry… Read Full Article

Posted on 23 May 2019

Indium Corporation Highlights Gold-Based Solder Paste

Indium Corporation's line of gold-based solder paste is used in a variety of high-reliability applications. Gold-based solder pastes offer numerous benefits, such as high tensile strength, high-melting point for compatibility with subsequent reflow processes, high thermal and electrical conductivity and thermal fatigue, resistance to corrosion, and excellent wetting. AuSn solder pastes… Read Full Article

Posted on 21 May 2019

Indium Corporation Expert to Present at High-Reliability Applications and SiP Seminar

Seven Liang

Indium Corporation's Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the Manufacturing and Processes for High-Reliability and System-in-Package Applications seminar on May 24 in Huizhou, China. Liang's presentation, How to Achieve High Reliability in Automotive Electronics, will focus on how to address the unique challenges encountered by automotive electronics assemblers.… Read Full Article

Posted on 14 May 2019

Indium Corporation Expert to Present at IMAPS Advanced SiP

Sze Pei Lim

Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at the Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California. Lim will present Soldering Material Challenges for Heterogeneous Integration and Assembly, which examines heterogeneous integration as the industry’s solution to overcoming miniaturization needs—such… Read Full Article

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