News Releases

Recent News and Press Releases

Posted on 14 Feb 2019

Indium Corporation Advisor to Present at TestConX 2019

David Saums

Indium Corporation advisor and founder/principal of DS&A LLC, David Saums, will present at TestConX 2019 from March 3-6, in Mesa, Arizona, USA. Saumswill present Design of a Four-Phase Mechanical Cycling Reliability Test Program and Evaluation Results for TIMs Designed for Semiconductor. The paper, co-authored by Tim Jensen, Product Manager for Engineer Solder Materials, and Ron Hunadi, Market Development Manager, Semiconductor… Read Full Article

Posted on 12 Feb 2019

Indium Corporation Features Unique Metal Thermal Interface Materials at Semi-Therm 2019

Indium Corporation will feature its unique solid/liquid hybrid metal thermal interface materials — m2TIM™ — during the Semi-Therm 35^thAnnual Symposium & Exhibit, March 18-22, San Jose, California, USA. Indium Corporation’s m2TIM^TMcombines liquid metal with a solid metal preform to provide reliable thermal conductivity for heat dissipation without the need for a solderable… Read Full Article

Posted on 7 Feb 2019

Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX Workshop 2019

Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring^®and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz. A pure indium Heat-Spring^®in the HSK pattern can be clad on one side with a thin layer of aluminum, which will prevent the indium from sticking to the… Read Full Article

Posted on 5 Feb 2019

Indium Corporation Launches New Water-Soluble, Halogen-Free Solder Paste

Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications. Indium6.6HF exhibits superior wetting to a variety of surface finishes resulting in the… Read Full Article

Posted on 29 Jan 2019

Chinese (Simplified)

Indium Corporation Announces Senior Level Promotions

Scott Pringle

Indium Corporation is proud to announce the promotion of three employees to high-level positions in their respective departments. Scott Pringle has been promoted to Business Unit Vice President. Pringle will continue to be a member of the Management Team, with his new position bringing a focus on aligning the Global Account… Read Full Article

Posted on 23 Jan 2019

Indium Corporation Actively Engaging Attendees on the 2019 IPC APEX Expo Show Floor

Indium Corporation will give IPC APEX Expo conference attendees numerous opportunities to witness the company's proven products live on the show floor, as well as an opportunity to meet with their voiding experts, from Jan. 29-31 in San Diego, California, USA. These live production line demonstrations support Indium Corporation's ongoing commitment to accurate and… Read Full Article

Posted on 16 Jan 2019

Indium Corporation Names Silver Quill Award Winners

Silver Quill Honorable mention awardees, from left, Greg Wade, Technical Support Engineer, Global Accounts; Kimberly Flanagan, Technical Support Engineer, USA; and Adam Murling, Technical Support Engineer, Global Accounts.

Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award. Indium Corporation’s Silver Quill Award program recognizes individuals who have authored original technical content in the form of conference papers, articles, presentations, and blog posts. It was designed to reward employees for generating leading-edge research and thought-leadership… Read Full Article

Posted on 15 Jan 2019

Indium Corporation Experts Honored with IMAPS 2018 Best Paper Award

Dr. Ning-Cheng Lee

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS’ 51^st International Symposium on Microelectronics, recently held from October 8-11, 2018, in Pasadena, California. Dr. Lee earned a Best of Track award for his paper Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications,… Read Full Article

Posted on 10 Jan 2019

Indium Corporation Experts to Present at Pan Pacific Microelectronics 2019

Dr. Ronald C. Lasky

Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, and Jonas Sjoberg, Associate Director – Global Tech Services, will present at Pan Pacific Microelectronics Symposium 2019 (PanPac) in Kauai, Hawaii, USA, Feb. 11-14, 2019. Dr. Lasky’s presentation, Tin Whiskers 101: Causes, Risks, and Mitigation 2019, will discuss the fundamentals of tin whiskers, the risks they pose… Read Full Article

Posted on 9 Jan 2019

Indium Corporation Expert to Present at IMAPS France Workshop

Tim Jensen

Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials, will present on liquid metal interface technology during IMAPS France’s 14^th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb. 6-7 in La Rochelle, France. Jensen’s presentation, Innovative Liquid Metal Interface Technology for TIM2 Applications, will examine methodologies and techniques that can enable liquid… Read Full Article

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