News Releases

Recent News and Press Releases

Posted on 22 Aug 2019

Indium Corporation Experts to Present at SMTA International

Dr. Ning-Cheng Lee

Four Indium Corporation experts will present at SMTA International, September 22-26, in Rosemont, Illinois, USA. Dr. Ning-Cheng Lee, Vice President of Technology, will lead a professional workshop on Novel Fluxes with Decreased Viscosity After Reflow for Flip-Chip and SiP Assembly. He will explain the development of fluxes for flip-chip and SiP assembly. These high-viscosity,… Read Full Article

Posted on 21 Aug 2019

Indium Corporation Features WS-446HF Flip-Chip and Ball-Attach Flux at SEMICON Taiwan

Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at SEMICON Taiwan 2019, September 18-20, in Taipei, Taiwan. WS-446HF flux is a robust, NIA (no intentionally added),halogen-free, water-wash flux that is designed to provide one simple solution to complicated applications, especially those with a single cleaning step for… Read Full Article

Posted on 21 Aug 2019

Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium

Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly(HIA) at the 31^stAnnual Electronics Packaging Symposium, September 5-6 in Niskayuna, New York, USA. Indium Corporation’s soldering materials for HIA applications have a proven track record of success in more than two billonfront-end module SiP devices manufactured over the last three years. From… Read Full Article

Posted on 20 Aug 2019

Indium Corporation to Host Reliability Symposium at SMTA Atlanta

Kim Flanagan

Indium Corporation, in cooperation with industry partners MicroCare and Weller, will host a half-day, reliability-focused technical symposium at SMTA Atlanta on September 12 in Peachtree Corners, Georgia. The SMTA Atlanta Reliability Symposium is the most recent in a series of technical symposiums hosted by Surface Mount Technology Association(SMTA). The event brings together global leaders to discuss best-in-class… Read Full Article

Posted on 15 Aug 2019

Indium Corporation Experts to Present at IMAPS Boston

Dr. Ning-Cheng Lee

Three Indium Corporation experts will share their expertise at the 52^ndInternational Symposium on Electronics (IMAPS) Boston, September 30–October 3, Boston, Massachusetts. Dr. Ning-Cheng Lee, Vice President of Technology, will lead a professional development course, Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration. The goal of this course is to provide participants with the understanding… Read Full Article

Posted on 13 Aug 2019

Elements of Indium by Indium Corporation: Burn-In

In celebration of Indium Corporation’s 85^thanniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49^thelement. Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with virtually… Read Full Article

Posted on 8 Aug 2019

Indium Corporation to Feature Indium8.9HF Solder Paste at Productronica India

Indium Corporation will feature its Indium8.9HF Solder Paste at Productronica India, September 25-27, in Greater Noida, Delhi National Capital Region, India. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process conditions, Indium8.9HF: Demonstrates consistent printing… Read Full Article

Posted on 7 Aug 2019

Indium Corporation Launches New Indium Oxide

Indium Corporation has released IndiOx™ (In2O3) for use in the manufacture of ITO sputtering targets for thin-film coating. IndiOx™ (In2O3) is a stable ceramic-like material that is insoluble in water and volatizes at 850°C. When doped with tin oxide, IndiOx™ forms ITO, the material of choice to form transparent conductive oxide… Read Full Article

Posted on 6 Aug 2019

Indium Corporation Features Indium8.9HF Solder Paste Series at SMTA International

Indium Corporation will feature its ultra-reliable, void-reducing Indium8.9HF Solder Paste for automotive applications at SMTA International, September 22-26, Rosemont, Illinois, USA. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. It is specially formulated to accommodate the higher processing… Read Full Article

Posted on 2 Aug 2019

Indium Corporation Expert to Present at 2019 ICEPT

Dr. Ning-Cheng Lee

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will share his industry expertise at the 20th International Conference on Electronic Packaging Technology (ICEPT 2019) on August 11-15, Hong Kong, China. Fluxes Suppressing Non-Wet-Open during BGA Assembly will examine the increasing severity of warpage and non-wet-open (NWO) defects during BGA assembly due to the continuing advancement… Read Full Article

View News Archive

Recent News and Press Releases

Related to News Releases