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Recent News and Press Releases

Posted on 10 Dec 2019

Indium Corporation Announces Promotion

Claire Hotvedt

Indium Corporation, Utica’s Technology Company^®, is proud to announce the promotion of Claire Hotvedt to the position of Product Development Specialist. She is based at the company’s Clinton facility. Hotvedt is responsible for facilitating team initiatives to deliver fully scaled, launched, and marketable solder pastes solutions for printed circuit board… Read Full Article

Posted on 9 Dec 2019

Indium Corporation Experts to Present at Eletrain Advanced Packaging and High-Reliability Seminar

Dr. Ning-Cheng Lee

Two of Indium Corporation’s experts will present on high-reliability materials and process optimization at the Eletrain Advanced Packaging and High-Reliability Seminar on December 12 in Dongguan, China. Dr. Ning-Cheng Lee, Vice President of Technology, will present Improving Reliability and Cleanability with a Novel Flux and Solder Alloy. He will talk about how an… Read Full Article

Posted on 5 Dec 2019

Indium Corporation to Feature Innovative Alloy at IPC APEX Expo

Indium Corporation will feature an innovative alloy and solder flux pairing that provides high-reliability and enhanced-performance capabilities at IPC APEX Expo February 4-6, in San Diego, Calif., USA. Indalloy^®292 is an innovative alloy engineered to provide advanced reliability for high-performance applications. It has excellent thermal cycling performance at -40–150°C conditions, high shear strength, and… Read Full Article

Posted on 3 Dec 2019

Indium Corporation to Feature Innovative New Alloy at IPC APEX Expo 2020

Indium Corporation will feature its new high-performance, high-reliability alloy technology at IPC APEX Expo, February 4-6, in San Diego, Calif., USA. Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications with reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to… Read Full Article

Posted on 26 Nov 2019

Indium Corporation Announces Promotions

Stephen Foster

Indium Corporation, Utica’s Technology Company^®, is proud to announce the promotion of three employees. Stephen Foster has been promoted to Plant Manager at Indium Corporation’s Clinton facility; Marlene Natale has been promoted to Quality Manager also at the Clinton Facility; and Gary Rotzler has been promoted to Quality Manager at the… Read Full Article

Posted on 21 Nov 2019

Indium Corporation Announces Innovative New Low-Temperature Alloy Technology

Indium Corporation continues to innovate alloy technologies with a new high-performance, high-reliability low-temperature alloy. Durafuse^™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. Where traditional low-temperature solders often produce brittle solder joints that are susceptible to drop shock failures,… Read Full Article

Posted on 19 Nov 2019

Indium Corporation to Feature InFORMS® Reinforced Solder Preforms for IGBT Assembly at NEPCON Japan

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS^®, for IGBT assembly at NEPCON Japan, January 15-17, Tokyo, Japan. Uneven solder bondline thickness between the substrate and baseplate of an IGBT module can create areas of increased stress, leading to delamination and premature failure during the operational life of the module. Indium… Read Full Article

Posted on 14 Nov 2019

Indium Corporation to Feature Fine-Grade Precision AuSn Ribbon at NEPCON Japan 2020

Indium Corporation will feature its fine-grade precision die-attach AuSn ribbon at NEPCON Japan, January 15-17 in Tokyo, Japan. AuLTRA^™-fine die-attach AuSn ribbon is designed for high-volume, fully-automated laser diode assembly. Indium Corporation's precision, high-volume production lines can produce AuLTRA^™-fine ribbons as small as 0.254mm (0.010") wide by 0.0152mm (0.0006") thick. The ribbon delivers… Read Full Article

Posted on 13 Nov 2019

Indium Corporation Experts Shared Market Insights at MMTA China Minor Metals Conference

$From left to right: Indium Corporation\'s Shuyan Peng, Strategic Sourcing Buyer, and Donna Vareha-Walsh, Director, Metals Business Unit.$

From left to right: Indium Corporation\'s Shuyan Peng, Strategic Sourcing Buyer, and Donna Vareha-Walsh, Director, Metals Business Unit.

Two Indium Corporation experts shared their industry expertise at the Minor Metals Trade Association (MMTA) China Minor Metals Conference, November 4-5, Hong Kong, China. Donna Vareha-Walsh, Director, Metals Business Unit, presented Indium Market Developments: An Update. This presentation examined the continued market impact of metals inventory on the Fanya Metal Exchange, which include Ga, Ge, APT, etc.,… Read Full Article

Posted on 12 Nov 2019

Indium Corporation Announces Strategic Partnership with Mycronic

Indium Corporation, a premium materials manufacturer and supplier of electronics assembly materials, and Mycronic, a global leader in dispensing and jet printing equipment, have formed a strategic partnership for the development of no-clean and water soluble solder pastes for jetting applications. The partnership with Mycronic will expand Indium Corporation’s portfolio of proven products designed… Read Full Article

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