News Releases

Recent News and Press Releases

Posted on 20 Sep 2019

Indium Corporation President, Expert to Present at Productronica India

Ross Berntson, President & Chief Operating Officer

Indium Corporation President and Chief Operating Officer Ross Berntson will share his industry expertise and insight during the CEO Forum at Productronica India, September 25-27, in Greater Noida, Delhi National Capital Region, India. Berntson will present Materials Science in Advanced Electronics Assembly on Wednesday, September 25. The forum, organized for the first time in 2016, is an opportunity… Read Full Article

Posted on 19 Sep 2019

Indium Corporation to Feature Solder Paste Solutions for Reliability at the Guadalajara Expo & Tech Forum

Indium Corporation will feature its proven suite of solder pastes for reliability at the Guadalajara Expo & Tech Forum, October 23-24 in Verde Valle, Guadalajara. Indium Corporation’s suite of solder pastes for reliability have a proven track record of eliminating common industry defects and delivering reliability in order to solve the assembly challenges of… Read Full Article

Posted on 18 Sep 2019

Elements of Indium by Indium Corporation: Wetting

In celebration of Indium Corporation’s 85^th anniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49^th element. Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with virtually… Read Full Article

Posted on 17 Sep 2019

Indium Corporation Expert to Present at IMAPS Autumn Conference 2019

Andreas Karch

Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the IMAPS Autumn Conference 2019, October 17-18, in Munich, Germany. Karch will present Flux Systems in Solder Pastes: The Demands on Electrical Reliability are Increasing. He will discuss how the advancing electricification of automobiles and the increase in operating hours… Read Full Article

Posted on 10 Sep 2019

Indium Corporation Expert to Present at SMTA New England Expo & Tech Forum

Meagan Sloan

Indium Corporation’s Meagan Sloan, Technical Support Engineer, will present on the importance of testing to ensure long-term reliability of flux residues during the SMTA New England Expo & Tech Forum, October 8, in Boxboro, Massachusetts, USA. Sloan’s presentation, The Basics of SIR and ECM, will discuss the importance of surface insulation resistance (SIR)… Read Full Article

Posted on 29 Aug 2019

Indium Corporation Expert to Present at SiP Conference China 2019

Aaron Yan

Indium Corporation’s Aaron Yan, Area Technical Manager, Semiconductor, will present at the SiP Conference China 2019, September 10-11, in Shenzhen, China. Yan’s presentation, Novel Water-Soluble Flux Study for Heterogeneous Integration Assembly, will detail a high-viscosity, high-tack flux designed to be used to secure components at the placement and reflow stage allowing the… Read Full Article

Posted on 29 Aug 2019

Indium Corporation to Feature Solder Paste at SiP Conference China 2019

Indium Corporation will feature its proven Indium3.2HF Solder Paste for fine-pitch printing at SiP Conference China 2019, September 10-11, in Shenzhen, China. Indium Corporation’s Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste specifically formulated with fine-pitch powders for fine-feature printing applications. Indium3.2HF offers consistent, repeatable printing performance, combined with a long stencil life. In… Read Full Article

Posted on 28 Aug 2019

Indium Corporation Features WS-446HF Flip-Chip and Ball-Attach Flux at CSPT 2019

Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at the China Semiconductor Packaging Test (CSPT) Technology & Marketing Annual Conference, September 8-10, Wuxi, China. WS-446HF flux is a robust, NIA (no intentionally added) halogen-free, water-wash flux that is designed to provide one simple solution to complicated applications, especially… Read Full Article

Posted on 28 Aug 2019

Indium Corporation Expert to Present at CSPT 2019

Leo Hu

Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Testing and Marketing Conference (CSPT 2019), September 8-10, in Wuxi, China. Hu’s presentation, Novel Water-Soluble Flux Study for Heterogeneous Integration Assembly, will detail a high-viscosity, high-tack flux designed to be used to secure components at the placement and reflow stage… Read Full Article

Posted on 27 Aug 2019

Indium Corporation Expert to Present at EMPC 2019

Graham Wilson

Indium Corporation expert Graham Wilson, Applications Engineer, will share his industry expertise at the 22^nd European Microelectronics and Packaging Conference, September 16-19, in Pisa, Italy. Wilson’s presentation, Substrate to Baseplate Attach: A Novel Solder Solution with an Embedded Metal Matrix for Enhanced Reliability, discusses the importance of strong, uniform bondline control between the power device… Read Full Article

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