News Releases

Recent News and Press Releases

Posted on 27 Nov 2018

Indium Corporation’s Indium10.1HF Solder Paste Wins Mexico Technology Award

From left: Iván Castellanos, Technical Services Manager, Latin America, Indium Corporation; Ron Friedman, Publisher, Mexico EMS; and Ross Berntson, President and COO, Indium Corporation.

Indium Corporation earned the Mexico Technology Award for its Indium10.1HF Solder Paste. The Mexico Technology Awards, sponsored by Mexico EMS, recognizes the best electronics manufacturing innovations in the electronics manufacturing industry in Mexico produced by OEM manufacturing equipment and materials suppliers over the last year. The awards are designed to promote best practices in technical… Read Full Article

Posted on 15 Nov 2018

Japanese

Indium Corporation to Feature AuSn Solder Preforms at NEPCON Japan 2019

Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the 48^th NEPCON Japan, Jan. 16-18 in Tokyo, Japan. Indium Corporation's AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. The semiconductor-grade AuSn preforms are designed to meet industry challenges as devices continue to get smaller, with… Read Full Article

Posted on 14 Nov 2018

Indium Corporation to Feature Indium8.9HF Solder Paste at IPC APEX EXPO 2019

Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at IPC APEX EXPO 2019, Jan. 29-31, in San Diego, California, USA. Electrical reliability is a must-have for electronic components and products to work properly, especially when issues like ionic contamination under low stand-off components can cause dendritic growth which can lead… Read Full Article

Posted on 8 Nov 2018

Chinese (Simplified)

Indium Corporation to Feature Soldering Materials for HIA and SiP at ELEXCON 2018

Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at the ELEXCON 2018, December 20-22 in Shenzhen, China. Indium Corporation’s soldering materials for HIA and SiP applications have a proven track record with more than 2 billon front-end module SiP devices manufactured in the last… Read Full Article

Posted on 7 Nov 2018

Indium Corporation VP of Technology to Lead Professional Development Course at EPTC 2018

Dr. Ning-Cheng Lee

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead a professional development course during the 20^th Electronics Packaging Technology Conference, Dec. 4-7 in Sentosa, Singapore. Dr. Lee will be a course leader, alongside other industry experts, for the professional development course Power Electronic Packaging Reliability, Materials, Assembly, and Simulations. The course will… Read Full Article

Posted on 1 Nov 2018

Indium Corporation to Feature Proven NC-SMQ®75 Die-Attach Solder Paste at CSPT 2018

Indium Corporation will feature its Die-Attach “Power-Safe” NC-SMQ^®75 Solder Paste at China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21 in Hefei, Anhui, China. NC-SMQ^®75 is an ultra-low residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable residue. NC-SMQ^®75's unique formulation has been proven in demanding… Read Full Article

Posted on 31 Oct 2018

Indium Corporation Expert to Present at CSPT 2018

Dr. HongWen Zhang

Indium Corporation’s, Dr. HongWen Zhang, Manager, R&D Alloy Group, will present at China Semiconductor Packaging Test Seminar (CSPT) 2018 from Nov. 19-21 in Hefei, Anhui, China. It is well known that lead-containing materials can have harmful effects on human health and the environment. Furthermore, emerging high power semiconductor devices and modules… Read Full Article

Posted on 30 Oct 2018

Spanish

Indium Corporation to Feature Indium8.9HF Solder Paste at SMTA Guadalajara Technical Forum and Expo

Indium Corporation will help attendees Avoid the Void^® by featuring its ultra-reliable Indium8.9HF Solder Paste series at SMTA Guadalajara Technical Forum and Expo, Nov. 14-15 in Guadalajara, Mexico. Indium8.9HF is an air reflow, no-clean solder paste that has been tested and approved for use in the automotive electronics industry. The Indium8.9HF series enhances the reliability… Read Full Article

Posted on 26 Oct 2018

Indium Corporation Experts Honored With Best Paper Award at IMPACT 2018

Dr. Ning-Cheng Lee

Two Indium Corporation experts were honored with a Best Paper Award at the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018, October 24-26, in Taipei, Taiwan. Dr. Ning-Cheng Lee, Vice President of Technology, presented Nano-Cu Sintering Paste for High Power Devices Die-Attach Applications at IMPACT 2017. The paper, co-authored… Read Full Article

Posted on 25 Oct 2018

Indium Corporation to Feature Soldering Materials for HIA at IEEE EPTC Singapore 2018

Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 20^th Electronics Packaging Technology Conference, Dec. 4-7 in Sentosa, Singapore. Indium Corporation’s soldering materials for HIA and SiP applications have a proven track record of success in more than 2 billon front-end module SiP devices manufactured in the… Read Full Article

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