Indium Corporation announces the appointment of Derrick Herron to Technical Support Engineer for the Northeastern United States.

In this role, Herron will provide comprehensive technical advice in the selection, use, and application of all of Indium Corporation’s solder products. Products include solder pastes, fluxes, solder alloy fabrications, and thermal interface materials.

Herron has more than five years of experience working with Dr. Ning-Cheng Lee in Indium Corporation's research and development laboratory. He also worked as a technician for Dr. Yan Liu, focusing on developments in solder paste and flux technologies. Herron has been granted one patent and has another pending. He has co-authored several research papers on the topic of QFN voiding.

Herron has a bachelor’s degree in chemistry from Oklahoma State University in Stillwater, Oklahoma. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College and was certified in IPC-A-600 and IPC-A-610-D.

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, germanium, and tin compounds, and high purity metals; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

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