Dr. Lee’s workshop, Electromigration – The Hurdle for Miniaturization and High Power Devices, is a three-hour course that examines the electromigration phenomenon, including the effect of current density and temperature, the path through Al and Cu solder, the effect of solder grain orientation, the effect of solder composition and solder volume, and the resistance of solder joints. Upon completion of the workshop, attendees will receive certification from the SMTA. To register for this workshop, visit www.nepconsouthchina.com/en/smta_2013/.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, as well as encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on high performance and low cost of ownership.
The SMTA South China conference is held in conjunction with Nepcon South China. The conference covers the industry’s most pressing issues in electronics assembly/manufacturing industry, including technology roadmaps, business focuses, advanced packaging, practical skill development, emerging technologies, and lead-free solder reliability.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.