Indium Corporation's Ryan to Address Techni-Tool's Biannual Meeting
July 25, 2014
Indium Corporation’s Pat Ryan, America’s sales manager, will share his technical knowledge at Techni-Tool’s biannual sales meeting on July 27 in Blue Bell, Pa.
Ryan’s presentation, What’s Trending, What’s Challenging, and What’s Making a Difference, will give an update on urgent current topics in electronics assembly, including: the elimination of non-wet opens, a summary of new solder alloys and dopants, and a review of recent electronic device teardowns.
Ryan manages Indium Corporation’s North and South American field sales team and sales channel partners. He also provides strategic direction for Indium Corporation’s diverse sales and distribution network. Prior to joining Indium Corporation, Ryan spent 10 years as a process engineer in the medical device manufacturing industry. He is an expert in providing solder solutions for customers in the electronics, semiconductor, and thermal management industries. Ryan earned his bachelor’s degree in mechanical engineering from the University of Portland.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.