Dr. Ning-Cheng Lee, Vice President of Technology, will present Reliability of Low Melting Mixed Lead-Free BGA Assembly. This presentation examines BGAs with SAC105, SAC305, and BiSnAg balls assembled with SAC105, SAC305, or 57Bi42Sn1Ag solder paste. Their joint mechanical strength, drop test performance, and voiding performance were evaluated against their reflow profile.
Dr. Lee will also present A Novel Epoxy Flux on Solder Paste for Assembling Thermally Warped POP. In this presentation, Dr. Lee discusses a newly-developed epoxy flux, compatible with solder paste, to address the drop failure of area array packages, such as BGAs, CSPs, and POP.
Additionally, Dr. Lee will give a professional development course, titled Package-on-Package Technology – What It Is, What Works, and What Doesn’t Work. This course covers package-on-package technology. Topics include trends, designs, material selection, processes, and reliability.
Dr. Ron Lasky, Senior Technologist, will co-chair the Pb-free Solder & RoHS session. Maria Durham, Product Support Specialist – Semiconductor and Advanced Assembly Materials, will co-chair the Bonding Materials and Processes session.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 30 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers, and holds several patent disclosures. Dr. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky.
Durham serves as a technical liaison between Indium Corporation’s customers and internal departments, such as sales, technical support, research and development, and operations to ensure the best quality and selection of products. She earned her bachelor’s degree in Physics and Applied Mathematics from Clarkson University in Potsdam, N.Y. While at Clarkson, she worked as a McNair Scholar focusing on electro-chemical deposition research.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions that bring together the entire microelectronics supply chain. Events and products focus on those technologies critical to the present and future of microelectronics: 3D integration, MEMS, flip chip, wafer level packaging, thermal management, printed electronics, advanced materials, photonics, modeling/design, as well as many others.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.