Several Indium Corporation technology experts will present their technical findings at the International Microelectronics and Packaging Society (IMAPS) New England Chapter Symposium May 7 in Boxborough, MA.
Tim Jensen, Product Manager – PCB Assembly Materials
- Presentation: SACm™ Solder: A high-reliability, low-cost alternative to SAC305
This presentation examines the reliability of a low Ag SAC alloy doped with Mn (SACm™). SACm™ is compared to eutectic SnPb, SAC105, SAC305 alloys under various test conditions, such as JEDEC drop shock, dynamic bending, thermal cycling, and cyclic bending.
- Poster: Jensen will present a poster on Material and Process Optimization for Head-in-Pillow Minimization.
Ed Briggs, Technical Support Engineer – Southeast USA and Eastern Canada
- Presentation: Minimizing Voids for QFN in Lead-Free Assembly
This presentation will discuss techniques for optimizing the assembly process for QFN components, best practices for lead-free reflow profiling, stencil aperture design, solder paste volume control to minimize void formation, preventing component floating, and subsequent opens on perimeter pads.
Seth Homer, Product Specialist for Engineered Solders and Thermal Materials
- Poster: Homer will present a poster on minimizing solder voiding in QFN packages using solder preforms.
Dr. Ronald C. Lasky, Senior Technologist
- Poster: Dr. Lasky will present a poster titled A Focus on Productivity
- Session Chair: Dr. Lasky will serve as the poster session chair.
Jeff Anweiler, Eastern USA and Canada Sales Manager
- SMT session chair.
Jensen is an SMTA-certified process engineer. He earned his bachelor’s degree in chemical engineering from Clarkson University. He has spent over 15 years working with customers to troubleshoot and optimize SMT process lines, and solving issues such as head-in-pillow, graping, and QFN voiding. Through his direct work on hundreds of SMT lines, he understands each customer’s unique requirements and readily shares his expertise by authoring technical papers and writing for technical publications. He also participates actively in several IPC standards development committees.
Briggs is an SMTA-certified process engineer. He earned his associate’s degree in chemical technology from Mohawk Valley Community College, where he received the Douglas J. Bauer Award for Excellence in Chemistry; he earned his Six Sigma Green Belt from Dartmouth College. Briggs joined Indium Corporation in 1992, and has held a variety of positions in production and technical support.
Homer has been with Indium Corporation for over 15 years, serving as manufacturing supervisor for various engineered electronics assembly materials, including solder spheres, sputtering targets, indium chemicals, and solder preforms. He has worked extensively with Indium Corporation’s customer support teams, especially those in China, Singapore, and Europe. He is currently pursuing a degree in business from Mohawk Valley Community College.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky.
Anweiler has over 15 years of experience in electronics manufacturing. He earned his bachelor’s degree in business and an MBA in technology management from the State University of New York Institute of Technology. Anweiler joined Indium Corporation in 1995 as a product specialist in applications engineering before moving to sales. He is well versed in all solder products, with a strong focus on SMT.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.