Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will share his industry expertise at the 20th International Conference on Electronic Packaging Technology (ICEPT 2019) on August 11-15, Hong Kong, China.

Fluxes Suppressing Non-Wet-Open during BGA Assembly will examine the increasing severity of warpage and non-wet-open (NWO) defects during BGA assembly due to the continuing advancement of miniaturization. He will discuss how a “cold-welding barrier” method utilizing a flux coating has been developed to suppress NWO defects. 

He will also present NovelFluxes with Decreased Viscosity after Reflow for Flip-Chip and SIP Assembly, which discusses the development of fluxes developed for flip-chip and system-in-package (SIP) assembly. These fluxes have high-viscosity and high-tack to secure components during placement and reflow, but have low-viscosity after reflow to allow the flux residue to be cleaned. 

Dr. Lee will also present the short course Achieving High Reliability for Lead-Free Solder Joints – Materials Consideration. This very popular course details the material considerations required for achieving high-reliability in lead-free solder joints. The goal of this course is to provide participants with the understanding of how various factors contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability. 

Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys and solder pastes for SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.​