Tuesday, Feb. 11, Dr. Lasky will chair the Daily Conference Keynote, The Invention of CMOS Image Sensors: A Camera in Every Pocket, and deliver three presentations:
- Autonomous Vehicles and AI: Status and Future—questions how far AI technology will go. Dr. Lasky will discuss the current state of autonomous vehicles and artificial intelligence projects, where they will be in the next decade, and in 50 years.
- Weibull Analysis 101: Plotting and Interpretation—offers a guide to the analysis method revered by most reliability professionals. Dr. Lasky will walk attendees through its history and show them how to perform Weibull analysis with software tools, such as Minitab.
- The Basics of Thermal Interface Materials (TIMs)—examines the basics of TIMs, progress in heat transfer technology, and the classification system for materials selection to meet application requirements.
Dr. Lasky is a Senior Technologist at Indium Corporation, as well as a Professor of Engineering and the Director of Lean Six Sigma at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has also authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association's Founder's Award in 2003. Dr. Lasky holds four degrees, including a Ph.D. from Cornell University in materials science, and is a licensed professional engineer.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.