Bottom termination component (BTC) use has increased substantially over the past decade, with today’s assemblies often encompassing various types of BTCs within one assembly. Flanagan’s presentation, Avoiding the Pitfalls of Voiding in PCB Assemblies, tells us how the industry has explored process modifications to assist with achieving the lowest voiding in large ground plane solder joints through optimizing pad design, pad patterning, stencil design, via positioning, solid solder addition, and reflow profiles. This presentation discusses how IPC’s recommendations for design and implementation of BTCs and impending changes to IPC-7093 can help minimize voiding and ensure robust BTC assemblies.
Flanagan provides technical support and guidance on process steps, equipment, techniques, and materials to customers. In addition, she provides technical training to staff and industry partners. Flanagan began her career with Indium Corporation through the company’s summer college internship program, working in the Quality Department. She remained with Indium Corporation as a part-time Quality Engineering Technician while she finished her bachelor’s degree in Physics from Le Moyne College and joined the technical support team in December 2016.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.