Indium Corporation Expert to Present at World Congress of Smart Materials 2019
February 26, 2019
Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will present at BIT's 5thAnnual World Congress of Smart Materials, March 6-8 in Rome, Italy.
Dr. Lee's presentation entitled Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applicationsreviews test results that demonstrate how a new alloy excels in harsh environments, including a wide temperature range and high CTE mismatch. Dr. Lee will also share data from existing application qualifications.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and an IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for the SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
To view additional papers authored by Dr. Lee and other Indium Corporation experts, visit www.indium.com/techlibrary.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.