Indium Corporation experts will share their technical expertise at a seminar for Manufacturing and Processes for High-Reliability and System-in-Package Applications on June 14 in Suzhou, China.
Wisdom Qu, Technical Manager for Eastern China, will present 01005/008004 Components Assembly Challenge.As the explosive growth of the Internet of Things (IoT) continues, so does the need for smaller and smaller passive and active electrical components. Qu will examine the effects of miniaturization on stencil printing and the reflow process. She will also discuss the results of small feature print experiments and her efforts to obtain consistent volume.
Pony Liao, Area Technical Manager, Northern China, will present The Reliability and Stability in the Solders for Automotive Electronics. Liao analyzes the higher requirements for solders in the automotive electronics industry, such as chemical stability, longevity requirements, and ultra-low voiding on power modules. He will also examine the industry’s needs concerning semiconductor packaging, substrate-level assembly, and security components requirements for SIR and ECM.
Qu provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and epoxy flux products. She is based in Suzhou, PRC. Qu has extensive experience in surface mount technology and has been with Indium Corporation since 2005. She earned a degree in mathematics from Hubei Radio and Television University in China, and is an SMTA Certified Process Engineer.
Liao provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than 10 years of experience in surface mount technology, specializing in defect prevention, quality continuous improvement, and cost reduction. Liao earned his bachelor’s degree from Tianjin University in mechanical and electronics engineering.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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