Ma’s paper, Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175°C, reviewed the testing results of her efforts to achieve high-reliability under a wide range of high-temperatures using the lead-free solder alloy also known as Indalloy®276. Her paper found that in order to achieve this, it is imperative to balance a solder alloy’s ability to handle tensile stress versus its rigidity.
Ma joined Indium Corporation in 2010 and is based in Suzhou, China. She is responsible for developing halogen-free, lead-free, and no-clean flux chemistries with low-voiding. Ma earned her bachelor’s degree in Chemistry from Qufu Normal University and her master’s degree in Physical Chemistry from Nanjing University.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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