Indium Corporation will feature its ultra-reliable Indium8.9HF-1 Solder Paste at NEPCON Asia, August 28-30, in Shenzhen, China. 

Indium Corporation’s Indium8.9HF-1 is specially formulated to deliver outstanding voiding performance for highly-reliable bottom-terminated components (BTC) in 5G wireless infrastructure applications. Indium8.9HF-1 also delivers a soft, pliable, post-reflow flux residue designed to stay probe-testable, resulting in unprecedented in-circuit testing (ICT) and flying-probe testing in first pass yields. 

Indium8.9HF-1is a Pb-free, no-clean solder paste intended for both air and nitrogen reflow that produces fewer false testing failures, which gives you faster cycle times and less rework. It also provides peace of mind, delivering high-reliability assemblies with:

  • High oxidation barrier that eliminates graping and HIP defects
  • Excellent print transfer efficiency 
  • Superior void minimization performance  

For more information about Indium8.9HF-1 Solder Paste and other high-reliability solder products for 5G assemblies, please visit www.indium.com/avoidthevoid or stop by booth #1L25 at the show.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.