Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, for IGBT assembly at NEPCON Japan, January 15-17, Tokyo, Japan.

Uneven solder bondline thickness between the substrate and baseplate of an IGBT module can create areas of increased stress, leading to delamination and premature failure during the operational life of the module. Indium Corporation’s InFORMS® are a specially designed composite solder preform with a reinforcing matrix designed for all-around reliability. This results in:

  • Improved mechanical and thermal reliability
  • Uniform bondline thickness
  • Low-voiding performance

InFORMS® provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.

For more information about InFORMS®, visit www.indium.com/informs or visit us at booth #ISP2-0407.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.