Indium Corporation's Silver Quill Award program encourages individuals to author world-class technical reports, presentations, articles, and books. It then honors the most effective works based on their relevance to, and impact on, the industry.
Coauthored by Herron, Nash, Luo, and Wei, the technical paper, Voiding Control Beneath BTCs Using Solder Fortification Preforms, discusses one of the biggest challenges facing the electronics assembly industry today – voiding in the solder joints that connect bottom-terminated components to PCBs. This paper explores a new technique that uses Solder Fortification® Preforms for an easy and inexpensive process modification that can decrease both the level of voiding and the amount of variation in this value.
Herron is a Technical Support Engineer for Indium Corporation and provides technical service to customers in the northeastern United States. Previously, he spent more than six years working in Indium Corporation's research and development laboratory, focusing on developments in solder paste and flux technologies. Herron earned his bachelor's degree in chemistry from Oklahoma State University, Stillwater, Okla. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth.
Nash, PCBA New Product Development Manager, is responsible for proactively planning, organizing, and implementing Indium Corporation's product development cycle from concept to product launch. His previous experience includes inside sales, product management, and technical support. Nash earned his bachelor's degree from Clarkson University and his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth. Additionally, he is an SMTA-certified process engineer.
Luo is Indium Corporation's Area Tech Manager, South China. He provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than eight years of experience in surface mount technology. Luo earned his bachelor's degree in mechanical and electronics engineering from Guilin University of Electronic Technology in Guilin, Guangxi, China.
Wei is a Senior Technical Support Engineer based in Shenzhen, China. He provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials for customers in southern China. Wei has more than eight years of experience in electronics assembly, providing field support for soldering materials and SMT process applications. He is an SMTA-certified process engineer.
The award-winning paper can be downloaded at www.indium.com/voiding-control-BTC.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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