Karch will present Miniaturization: Solder Paste Attributes for Maximizing the SMT Print and Reflow Manufacturing Process Window, which details the development of a flux technology platform to achieve print consistency by maximizing paste transfer and minimizing deviation for small apertures (sub-300 microns diameter, area ratios of 0.5-0.6); eliminate HIP with an enhanced oxidation barrier approach, as opposed to just making a flux more active; achieve complete solder coalescence and prevent clumpy solder joints; and achieve very low-voiding.
Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, including solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of automotive industry experience, including the advanced development of customized electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt. The Austrian Patent Office also selected him as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.
InnovationsFORUM is an event for electronics manufacturers to learn the most advanced technologies, materials, and processes.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.