Indium Corporation Features "Power-Safe" NC-SMQ®75 Die-Attach Solder Paste at SEMICON China
February 18, 2016
Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world's first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach applications, at SEMICON China March 15-17, 2016, in Shanghai, China.
NC-SMQ75 is an ultra-low residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable, residue of less than 0.5 percent (by weight) of solder paste. It is designed for reflow in a nitrogen or forming gas atmosphere of 100 ppm oxygen or less and can survive the high temperatures associated with the reflow of high-melting die-attach alloys. It is particularly suitable for use with the industry standard die-attach solder alloys Indalloy 151 (Pb92.5/Sn5/Ag2.5) and Indalloy 163 (Pb95.5/Sn2/Ag2.5).
NC-SMQ75's unique flux formulation allows manufacturers using non-wirebonded analog devices to eliminate the high cost of chemicals and waste generated by the cleaning step in power semiconductor assembly. NC-SMQ75, which has been in use for more than a year by multiple assemblers, including those in demanding high-reliability automotive applications, has been proven to meet JEDEC/IPC J-STD-020 and MSL1, 2, and 3 standards by manufacturers in Asia.
For more information about NC-SMQ®75, visit Indium Corporation's booth N1-1661 at SEMICON China.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or @IndiumCorp.