Indium Corporation Names Nash as Product Manager - PCB Solder Paste
February 14, 2017
Indium Corporation has named Chris Nash as Product Manager for PCB Assembly Materials.
Nash is responsible for managing new solder paste product development, including strategy guidance and execution, directed to sales to the printed circuit board industry. In addition, he will provide solder paste product support, including leading marketing communications efforts, delivering field sales and technical team training, and interfacing with manufacturing for increased customer support.
Nash has worked for Indium Corporation for more than 10 years and has served in a number of roles, including inside sales, product management, and global technical support. His most recent role was New Product Development Manager for PCBA.
Nash earned his bachelor’s degree from Clarkson University and holds his Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering. He is an SMTA-certified Process Engineer and holds certifications from the IPC for both A-600 and A-610D standards.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.