Wilson's paper, Sn+ Heat-Spring® Solder TIMs for Superior Thermal Management, explores how Heat-Spring thermal interface materials (TIMs) perform against phase change materials and thermal greases under a variety of conditions. Wilson will also present comparative results as they relate to power cycling and bake testing, and discuss the advantages of Heat-Springs®.
Wilson is an applications engineer for Indium Corporation's European operations. He supports customers with comprehensive technical advice on the selection, use, and application of solder pastes, fluxes, and engineered solders. He has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management. He is certified as a Six Sigma Green Belt through Dartmouth College's Thayer School of Engineering and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.
IMAPS France has more than 200 members who are dedicated to promoting the knowledge and expertise of organizations and businesses in the electronics packaging and assembly industries.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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