Indium Corporation Features Indium10.1 Pb-Free Solder Paste at APEX
January 8, 2015
Indium Corporation will feature its new solder paste, Indium10.1, at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif.
Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
The oxidation-inhibiting properties of Indium10.1 provide industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.
Indium10.1 offers the lowest cost of ownership to PCB assembly manufacturers through best-in-class printing and soldering performance, including best-in-class print definition and transfer efficiency, low-voiding performance, and head-in-pillow and graping resistance.
Indium Corporation will be exhibiting at booth 1027.
For more information about Indium10.1 or Indium Corporation's complete Pb-free Solder Paste series, visit www.indium.com/indium10.1, or email askus@indium.com.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.