Indium Corporation's Tim Jensen, senior product manager for engineered solders, will share his expertise at the Surface Mount Technology Association International's (SMTAI)Power and High-Temperature Electronics Manufacturing Experience Sept. 30- Oct. 1 in Rosemont, Ill. 

High-Pb solders are still used in a large number of electronics applications. However, legislation is driving the need for all industries to develop Pb-free solder alternatives that have a relatively high melting point. Jensen will present Pb-Free Alternatives for High Temperature Soldering on Sept. 30 at 11 a.m. His presentation will review this issue and present new alternatives for Pb-Free solders that are more responsibly priced, with a high melting point that can be easily processed using existing equipment. Examples of these options include BiAgX® solder paste and composite preform technology, which are user-friendly materials that can replace high-Pb alloys in many applications.

Jensen is an SMTA-certified process engineer. He earned his bachelor's degree in chemical engineering from Clarkson University. He has spent more than 15 years working with customers troubleshooting and optimizing SMT process lines, and solving issues such as head-in-pillow, graping, and QFN voiding. Jensen is responsible for Indium Corporation's most diverse product group, which includes solder preforms, wire, ribbon, and foil, as well as thermal interface materials. 

SMTAi is an annual technical conference and exhibition on electronics assembly and advanced packaging that draws industry professionals from around the world. This year's event will also be the first to separately feature content dedicated to power electronics and high temperature. The "Power and High-Temperature Experience" aims to help engineers learn more about what is involved in this process, what new materials and challenges to expect, as well as basic assembly issues. For more information about the event, visit

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email