Four of Indium Corporation's technology experts will present their technical findings at APEX in Las Vegas, Nevada, April 10-14, 2011.

  • Ning-Cheng Lee, Ph.D., Vice President of Technology - Thermal Pad Design at QFN Assembly for Voiding Control
  • Ronald C. Lasky, Ph.D., PE, Senior Technologist -  Applications of Solder Fortification® with Preforms
  • Mario Scalzo, Senior Technical Support Engineer - Down Selecting Low Solids Fluxes for Pb-Free Selective Soldering
  • Eric Bastow, Senior Technical Support Engineer  - The Effects of Flux Residues on Reliability

In addition, two of Indium's technical team co-authored papers that will also be presented at the APEX technical conference:

  • Tim Jensen, Product Manager  - A Review of Test Methods and Classifications for Halogen-Free Soldering Products
  • Chris Anglin, Technical Support Engineer - Global Accounts Effect of Nano-Coated Stencil on 01005 Printing

Tim Jensen will also chair the technical session for Soldering Processes I.

Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is also a member of the SMTAI planning committee.

Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog which can be found at

Tim Jensen is the Product Manager for PCB Assembly Materials. He is an SMTA-Certified SMT Process Engineer. He has spent over a decade troubleshooting and optimizing SMT process lines. He works closely with Indium's Technical Service, Research & Development, and Sales Teams to ensure that Indium continues to offer cutting edge products to meet unique challenges in the electronics assembly industry. Tim has a bachelor's degree in Chemical Engineering from Clarkson University. He has authored several technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.

Eric Bastow joined Indium Corporation in 2001 developing new solder paste flux chemistries under the direction of Dr. Ning-Cheng Lee. He also gained experience performing residual gas analysis of hermetic electronic packages and developing electroless nickel-plating bath chemistries. Eric is an SMTA-Certified Process Engineer (CSMTPE) and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He has an associate's degree in Engineering Science from the State University of New York and has authored several technical papers and articles.

Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor's degree in Chemistry from Saint Anselm College and a certificate from the American Chemical Society for Professional Education. He is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College's Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog.

Chris Anglin has over 15 years of experience in advanced process development, new product introduction, and electronics assembly manufacturing. He has a master's degree in Industrial Engineering from the State University of New York at Binghamton. He is trained in Six Sigma Black Belt programs and is also an SMTA-Certified Process Engineer.

Indium Corporation will be exhibiting at booth 2065.

For more information about APEX and the technical conferences, visit

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email