Indium Corporation’s Ning-Cheng Lee, Vice President of Technology; Karthik Vijay, Technical Manager – Europe, Africa, and the Middle East; and Wolfgang Bloching, Regional Sales Manager – Germany, Austria, and Switzerland, will present at SMT Hybrid Packaging in Nuremberg, Germany, April 16-18, 2013.

Dr. Lee will present two tutorials:

  • Solder Defects for Advanced SMT Manufacturing – Formation Mechanism Troubleshooting. This tutorial will address the following solder defects for advanced SMT manufacturing:
    • Head-in-pillow
    • Graping
    • QFN voiding
    • Micro-voiding on immersion silver
    • Fragile BGA solder joint and polymeric reinforcement
    • Creep corrosion
  • Electromigration – The Hurdle for Miniaturization and High-Power Devices. This tutorial will examine the electromigration phenomenon, including:
    • The effect of current density and temperature
    • The path through Al and Cu solder
    • The effect of solder grain orientation
    • The effect of solder composition and solder volume
    • The resistance of solder joints, and more

Vijay will deliver a tutorial, titled Lead-free SMT Assembly for High Reliability, Yield, and Throughput. The tutorial will cover selecting the best solder alloy, evaluating solder pastes, discussing different PWB pad finishes, and the effect of lead-free reflow temperatures on the PWB. After briefly reviewing component lead finishes, he will lead a detailed discussion on optimizing the stencil printing process. Component placement issues will be reviewed and the steps in setting up an effective reflow process will be covered.

Bloching will present Engineered Solder Preforms and Unique Flux Chemistries to Maximize the SMT Process Window. This presentation details the benefits of using solder preforms to address insufficient or excess solder, eliminate rework, and improve first-pass yield and end product reliability in electronics assemblies.

Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, as well as encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on high performance and low cost of ownership.

Vijay is based in the UK and is responsible for Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at industry forums and conferences internationally.

Bloching is a German state-certified engineer in the field of electronics process and engineering. He is responsible for sales in Germany, Austria, and Switzerland for Indium Corporation’s soldering products, including: solder paste, solder wire, engineered solder materials, and thermal management materials. Bloching has over 15 years of experience in electronics manufacturing.

SMT Hybrid Packaging is Europe’s leading event on system integration in microelectronics. Parallel to the exhibition, the SMT Hybrid Packaging conference is the most important platform for information and networking in the field of microelectronics assembly. The event is a high-class, user-oriented conference, which covers current issues and offers a large number of practice-oriented half-day tutorials.

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, germanium, and tin compounds, and high purity metals; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

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