QuickSinter<sup>®</sup>

QuickSinter®

QuickSinter® silver sintering pastes are unique products
that are capable of fast sintering on a variety of surfaces and die metallizations.

Introduction

Indium Corporation’s QuickSinter® silver sintering pastes are high metal-loading materials designed to fit easily into a dispense process with no change of deposition equipment. The pastes can also use fast “reflow-like” (RFL) sintering processes to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces.
Solder and many standard epoxy-silver materials are proving increasingly unsuitable for many discrete and small module device applications. They may, for example, be incapable of surviving the ambient conditions seen from longer mission profiles for automotive applications. These mission profiles typically drive longer high-temperature operating life (HTOL) and larger temperature swings in usage (thermally cycling).
QuickSinter<sup>®</sup>
QuickSinter<sup>®</sup>
>3 dots/second Consistent, High-Speed Dispensing

Features & Benefits

  • Proven fast sintering with excellent joint strength
  • Pressureless sintering solution with pressurized sintering capabilities
  • Controllable bondline thickness from 30-70µm
  • Versatile sintering profiles
  • Voiding <1%*
  • Porosity <30%*

Average on most application runs

Product Portfolio

QS815-AR

Indium Corporation’s QS815-AR Silver Sintering Paste is a high metal-loading material designed to fit easily into a printing or dispensing process with no change of deposition equipment. The paste can also use fast “reflow-like” (RFL) sintering to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces. QS815-AR is a pressureless and pressure silver sintering formulation which can be sintered in a variety of atmospheres.

High Quality Printing
High Quality Printing

Optimal Process Parameters:

  • Pressure: 5-6 kgf
  • Speed: 35-50 mm/s
  • Separation Speed: 5 mm @ 0.5 mm/s

Results:

  • Print life ≥ 4 hrs
  • Evaluation stopped when one deposit failed visual inspection
Profile from Budatec VS320
Pressure Sintering

Known Pressure Parameters:

  • Print deposit uniform and smooth
  • Pre-dry 3 min @ 120°C
  • Sinter time 180-300 sec at 260°C
  • Pressure: 5-25 MPa
  • Cu and Ag surfaces

QS815-SD

Indium Corporation’s QS815-SD Silver Sintering Paste is a high metal-loading material designed to fit easily into a dispense process with no change of deposition equipment. The paste can also use fast “reflow-like” (RFL) sintering processes to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces, depending on sinter atmosphere and sinter profile. QS815-SD is our easy-to-dispense pressureless silver sintering formulation.

QuickSinter<sup>®</sup>
Dispense Results

Dispensed over a 48 hr period:

  • 100+ boards dispensed
  • 600 dots per board
  • Dot diameter remained constant:
    - 1.00 mm ± 0.03 mm
  • Dot volume remained constant:
    - 0.100 mm3 ± 0.006 mm3
  • Entire syringe was dispensed
  • No skips or misses

What is Sintering

  • Metal sintering is the interdiffusion of surface atoms on adjacent metal particles to create an open network of tiny microvoids, versus traditional solder which melts (reflows) completely
  • Temperature, pressure, time, and nature of the sintering atmosphere are the primary factors controlling densification and joint strength
  • It is often the process of choice for forming joints involving materials with high melting points

Why Silver Sintering?

  • High reliability
  • Highest electrical conductivity
  • High thermal conductivity
    • Higher than Cu
  • High temperature applications
  • Less reactive than Cu
Metallic Elements: Electrical and Thermal Conductivity