Indium preforms offer very precise volumes of solder, and are cut to fit some very interesting bond-line shapes.
Some examples of preform applications are: bonding lids on sealed packages, thermal interfaces, and custom cut cryogenic sealing gaskets. We even know how to make a boring old rectangular preforms "exciting" (and highly more functional) – by patterning the surface. (Click here to learn about HeatSpring® technology).
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Innovative Metal TIMs for AI/GPU Processors As artificial intelligence (AI) and high-performance computing (HPC) technologies evolve, their computational demands have skyrocketed, leading to a
When people think of advancements in medical technology, things like surgery-assisting robots, AI diagnostics, or neurostimulators – like Neuralink’s ‘Blindsight’ –
It’s no secret that indium and indium-silver solder thermal interface materials (TIMs) show great potential for maximizing thermal performance in high-performance computing (HPC) and AI
