Pb-Free Including High Temperature Pb-Free
Lead (Pb)-containing solders have been used for many years for wafer and substrate-bumping applications. Most recently, these solders have been replaced by Sn-based Pb-free solders; however, the majority of cutting-edge applications, such as copper pillar/microbump, have moved to a low-silver plated solder. Additionally, some very fine pitch temperature-sensitive applications now use pure indium or indium-silver-plated bumps.
The selection of lead-based alloys for power semiconductor applications is large, and their usage is likely to continue into the future. However, some long-standing lead-free alloys and some novel high-melting Pb-free solder paste technologies are in use in specific applications:
|Lower Tj IGBT usage||96.5||3.5||221°C||Eutectic|
|Also known as "J-alloy"||65||25||10||233°C||Eutectic|
|Commonly used in step-soldering processes||95||5||237°C||240°C|
|Highest Sb content possible in standard Sn/Sb wire||91.5||8.5||241°C||248°C|
|Commonly used in step-soldering processes||90||10||243°C||257°C|
|Highest melting standard Sn/Sb alloy||86||14|
|Very poor solder-ability||11||89||262°C||360°C|
|Very high tensile strength and thermal / electrical conductivities||20||80||280°C||Eutectic|
|Usable for very high Tj die-attach such as SiC||88||12||356°C||Eutectic|
Pb-Free Including High Temperature Pb-Free Technical Documents
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Pb-Free Including High Temperature Pb-Free Blog Posts
Andreas Karch reviews how you can Avoid The Void® with Indium8.9HF Solder Paste
In today’s electronics manufacturing industry, many companies are using lead-free solder alloys. However, there are a few sectors in the industry that prefer the reliability and performance of tin-lead alloys. I’ve recently received a number of questions from customers asking how to adjust their solder pot to get the desired...
If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders are now in increasing use and gaining popularity due to their lower melting temperatures—58Bi/42Sn is eutectic at 138°C and 57Bi/42Sn/1Ag melts 137-139°C (both are Pb-free alternatives). A low-temperature solder is advantageous...
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