Change Drivers for Power Semiconductor Assembly

Pb-free

• RoHS2 / European End-of-Life Vehicle legislation:
  • Possible expiration of exceptions for Pb-based solders by end of 2016
    • DA-5 consortium is main driver

Higher Temperatures

• New and emerging needs for T_j > 175°C driving new materials requirements, and also away from high-Pb solders
  • GaN on Si / SiC

No-Clean

• Eliminate costs and waste associated with cleaning process
  • Equipment capital costs / cleaning materials / maintenance / waste disposal

Low Alpha (LA) Particle Emission

• Controlled alpha emissions (<Xcph/cm²)
  • Leakage current / latch-up concerns in thinned wafers
  • Power semiconductor wafer thicknesses now down to 50microns

Halogen-Free

• Reduce or eliminate halogens (Br, Cl) in materials and processes:
  • JEDEC JS-709A (May 2012)
  • Compatibility concerns:
    • Electrochemical migration / copper wire / epoxy non-curing leading to delamination