High Temperature Effects on BiAgX®
Taken from "Reliability Assessment of BiAgX® Die-Attachment for SiC Power Modules"
Tanimoto S. et al, JSAP [Japanese Journal of Applied Physics], April 2013
BiAgX® and High-Pb Joint Strength: Effects of Time and Temperature
- 3x additional reflows at peak temperature of 260°C
- Thermal cycle at -55°C to 125°C 2000 cycles
- Thermal shock at -55°C to 150°C 2000 cycles
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