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Package-on-Package Paste

Home » Products » Solder Paste and Powders » Package-on-Package Paste

  • Package-on-Package Paste
  • Related
    Technical Documents
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    Blog Posts
Package-on-Package Paste

Package-on-package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.

Package-on-Package Diagram

Package-on-Package Diagram

Related Markets and Applications

  • Semiconductor and Advanced Assembly
  • PCB Assembly

Critical Products

Equipment Partners

  • Fuji

Package-on-Package Paste Technical Documents

Whitepapers

Request This Document
Watch Video

Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly

Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu, Pamela Fiacco

Request This Document

Thermal Pad Design and Process for Voiding Control at QFN Assembly

Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu

Presentations

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Application Notes

Setting Up a Package-On-Package Assembly Process (US Letter)

Product Data Sheets

PoP Paste Indium5.79 (US Letter)
PoP Paste Indium5.79 (A4)
PoP Paste Indium9.88 (US Letter)
PoP Paste Indium9.88 (A4)
PoP Paste Indium9.88-HF (US Letter)
PoP Paste Indium9.88-HF (A4)

Safety Data Sheets

Gold Containing Alloys
Indalloy® with Indium9.88HF

Package-on-Package Blog Posts

2019 SPIE Photonics West Show

29 Jan 2019 by Bernard Leavitt [view bio]

Visit us at SPIE West show at booth #3310 on February 5-7. We look forward to learning more about your applications.

Read More

A Precise Equation Relating Karats of Gold to Density in Gold Alloys

29 Nov 2018 by Dr. Ron Lasky [view bio]

Dr. Ron received a question asking him to verify a calculation used to determine the karat value of various gold-based alloys. It's not as simple as it appears. Read this post to see how Dr. Ron answers the question.

Read More

The Impact of Bonding Surface Plating on the Reliability of a AuSn (Gold-Tin) Solder Joint

08 Nov 2018 by Bernard Leavitt [view bio]

Performing die-attach using AuSn solder alloy preforms against gold plating? You may need an off-eutectic solder alloy to compensate for the Au that is scavenged from the plating during the reflow process get you back to 80Au/20Sn.

Read More

View All Blog Posts

For comments or questions about the content on this page, please contact:

Christopher Nash
Product Manager PCB Assembly Materials
cnash@indium.com

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