Package-on-package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.
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Dr. Ron received a question asking him to verify a calculation used to determine the karat value of various gold-based alloys. It's not as simple as it appears. Read this post to see how Dr. Ron answers the question.
Performing die-attach using AuSn solder alloy preforms against gold plating? You may need an off-eutectic solder alloy to compensate for the Au that is scavenged from the plating during the reflow process get you back to 80Au/20Sn.
For some reason, I find the combination of gold and indium incredibly interesting. This shouldn’t come as a surprise; I caught gold fever panning for gold during a trip to Alaska, and “indium fever” is a pre-requisite for my job. Well, if it isn’t – it should be.
From One Engineer to Another®
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