Package-on-Package Paste
Package-on-package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.
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2019 SPIE Photonics West Show
Visit us at SPIE West show at booth #3310 on February 5-7. We look forward to learning more about your applications.
A Precise Equation Relating Karats of Gold to Density in Gold Alloys
Dr. Ron received a question asking him to verify a calculation used to determine the karat value of various gold-based alloys. It's not as simple as it appears. Read this post to see how Dr. Ron answers the question.
The Impact of Bonding Surface Plating on the Reliability of a AuSn (Gold-Tin) Solder Joint
Performing die-attach using AuSn solder alloy preforms against gold plating? You may need an off-eutectic solder alloy to compensate for the Au that is scavenged from the plating during the reflow process get you back to 80Au/20Sn.
For comments or questions about the content on this page, please contact:
Christopher Nash
Product Manager PCB Assembly Materials
cnash@indium.com
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