Pb-Free Water-Soluble Solder Pastes
Over the last decade, the electronics industry has shifted to no-clean fluxes for surface mount assembly. Despite this industry trend, Indium Corporation has not only maintained a variety of water-soluble solder pastes and fluxes, but has revolutionized the category with the release of several new and versatile solder pastes. These solder pastes allow current water-wash manufacturing processes to not only survive, but to thrive.
Indium6.6HF is a new water-soluble halogen-free solder paste that is compatible with both Sn/Pb and Pb-free alloys. It is designed to provide exceptional printing performance and minimize voiding in PCB assembly applications. Indium6.6HF exhibits superior wetting to a variety of surface finishes resulting in the fewest number of voids, a reduction in the size of the largest void, and minimized overall voiding. Other benefits include:
- Halogen-free per IEC 61249-2-21 test method EN14582
- Exceptional printing process window:
- High transfer efficiency
- Long stencil life (up to 12 hours)
- Excellent response-to-pause
- Prints consistently at a wide range of speeds
- High tack value (>8 hours) ensures consistent component holding power, allowing high-speed component placement operation
- Cleanable up to at least 72 hours after reflow
Products compatible with Indium6.6HF Solder Paste:
|1081||Low||28.4||0.957||ORH0||ORH0||< 50 ppm||Foam||16-1081||Preferred product.
|Electronics applications; water-soluble|
Other Water-Soluble Solder Pastes:
|Indium3.2||Industry-tested quality and reliability|
|Indium3.2HF||Halogen-free solder paste with similar performance to Indium3.2|
|Indium6.6HF||Versatile option for water-wash processes|
|Indium6.4R||Superior wetting to a variety of surface finishes|
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From One Engineer to Another®
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