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Options for Solder and Other Die-Attach Materials

Home » Products » Solder Paste » BiAgX® » Options for Solder and Other Die-Attach Materials

  • Options for Solder and Other Die-Attach Materials
  • Related
    Technical Documents
  • Related
    Blog Posts
Options for Solder and Other Die-Attach Materials
  • High-Pb alloys
  • SnSb+ alloys
    • SnSb, SnSbAg, etc
  • Zn-based alloys
    • ZnAl and ZnSn
  • Au-based alloys
    • AuSn, AuSi, and AuGe
  • Bi-based alloys
    • BiAg, BiCu, BiZn, and BiSn-Cu
  • TLP bonding materials
    • AgIn, AgSn, and CuSn
  • Diffusion bonding materials
    • Nano-Ag and Nano-Cu

Related Markets and Applications

  • Medical
  • LED

Top BiAgX® Technical Documents

  • Reliability of BiAgX® Solder as a Drop-In Solution (Paper)

    Technical Paper

  • High-Reliability, High-Melting, Mixed Lead-Free BiAgX® Solder Paste System (Paper)

    Technical Paper

  • SMTAnews Journal April-June 2013 (Other)

    Other Document

  • BiAgX® Presentation, 2015 (Presentation)

    Presentation

BiAgX® Technical Documents

Whitepapers

Request This Document

BiAgX®: High-Temperature Lead-Free (Pb-free) Solder Paste

Authors: Andy C. Mackie PhD, HongWen Zhang

Request This Document

High-Reliability, High-Melting, Mixed Lead-Free BiAgX® Solder Paste System

Authors: Dr. Ning-Cheng Lee, HongWen Zhang

Request This Document

Reliability of BiAgX® Solder as a Drop-In Solution

Authors: Dr. Ning-Cheng Lee, HongWen Zhang, Indium Corporation

Presentations

Request This Presentation

BiAgX® Presentation, 2015

Authors:

Application Notes

No application notes to display

Product Data Sheets

Indium7.08 BiAgX® High Temperature Pb-Free Dispensing Solder Paste (US Letter)
Indium7.08 BiAgX® High Temperature Pb-Free Dispensing Solder Paste (A4)
Indium7.16 BiAgX® High Temperature Pb-Free Printing Solder Paste (US Letter)
Indium7.16 BiAgX® High Temperature Pb-Free Printing Solder Paste (A4)

Safety Data Sheets

BiAgX® with Indium7.08
BiAgX® with Indium7.16

Other Documents

Indium7.08 BiAgX® High Temperature Pb-Free Dispensing Solder Paste Technical Report (Other)
Kyzen Cleaning Characterization Report for Indium7.08 BiAgX® High Temperature Pb-Free Dispensing Solder Paste (Other)
SMTAnews Journal April-June 2013 (Other)
Indium7.16 BiAgX® High Temperature Pb-Free Printing Solder Paste Technical Report (Other)
Kyzen Cleaning Characterization Report for Indium7.16 BiAgX® High Temperature Pb-Free Printing Solder Paste (Other)

BiAgX® Blog Posts

IMAPS 2013: International Symposium on Microelectronics

Thursday, September 19, 2013 by Maria Durham [view bio]

The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending both as an exhibitor and as a session co-chair. TECHNICAL SESSION: This year there will be 6 technical...

No-Clean Solder Paste for Clip-bonding Die-Attach

Thursday, September 13, 2012 by Dr. Andy Mackie [view bio]

I'm just back from Malaysia, where I visited one of our larger customers who has been using our high-lead (high-Pb) dispensable NC-SMQ75 solder paste for many years. No surprises there, but what many people don't realize is that the NC-SMQ75 solder paste can be used as a no-clean material...

Increased Use of Electricity for Lead-Free Soldering Assembly & High-Melt Lead-Free Solders

Wednesday, August 10, 2011 by Dr. Ron Lasky [view bio]

Folks, An obvious disadvantage of lead-free electronics soldering assembly is that the oven must be hotter and therefore will use more electricity (versus 63Sn37Pb soldering). But is the extra amount of electricity significant? Bill O'Leary claims...

High Melting Pb-free Solder Paste

Wednesday, August 3, 2011 by Dr. Andy Mackie [view bio]

Dr Ning-Cheng Lee (Indium Corporation's Vice-President of Technology) just let me review his team's excellent upcoming paper on solder technology for high temperature Pb-free (lead-free) [HTLF] applications, such as Power Semiconductor die-attach. Dr Lee...

View All Blog Posts

For comments or questions about the content on this page, please contact:

Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
amackie@indium.com

From One Engineer to Another®

All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.

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