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Top BiAgX® Technical Documents
Reliability of BiAgX® Solder as a Drop-In Solution (Paper)
Technical Paper
High-Reliability, High-Melting, Mixed Lead-Free BiAgX® Solder Paste System (Paper)
Technical Paper
SMTAnews Journal April-June 2013 (Other)
Other Document
BiAgX® Presentation, 2015 (Presentation)
Presentation
BiAgX® Technical Documents
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BiAgX® Blog Posts
IMAPS 2013: International Symposium on Microelectronics
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending both as an exhibitor and as a session co-chair. TECHNICAL SESSION: This year there will be 6 technical...
No-Clean Solder Paste for Clip-bonding Die-Attach
I'm just back from Malaysia, where I visited one of our larger customers who has been using our high-lead (high-Pb) dispensable NC-SMQ75 solder paste for many years. No surprises there, but what many people don't realize is that the NC-SMQ75 solder paste can be used as a no-clean material...
Increased Use of Electricity for Lead-Free Soldering Assembly & High-Melt Lead-Free Solders
Folks, An obvious disadvantage of lead-free electronics soldering assembly is that the oven must be hotter and therefore will use more electricity (versus 63Sn37Pb soldering). But is the extra amount of electricity significant? Bill O'Leary claims...
High Melting Pb-free Solder Paste
Dr Ning-Cheng Lee (Indium Corporation's Vice-President of Technology) just let me review his team's excellent upcoming paper on solder technology for high temperature Pb-free (lead-free) [HTLF] applications, such as Power Semiconductor die-attach. Dr Lee...
For comments or questions about the content on this page, please contact:
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
amackie@indium.com
From One Engineer to Another®
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