Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
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Die-Attach Technical Documents
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Die-Attach Blog Posts
Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?
Exploring the many benefits of InForm® soldering technology.
“How do I reduce my die-attach voids?” There is no sliver bullet, but here is a process to help you identify and reduce your voiding.
From One Engineer to Another®
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