Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Top Solders Technical Documents
Die-Attach Technical Documents
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Die-Attach Blog Posts
We’re featuring our Au solder product line and braze materials at the High-Temperature Electronics Network (HiTEN 2019) at St. Anne’s College in Oxford, UK.
Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?
Exploring the many benefits of InForm® soldering technology.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.