Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
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Die-Attach Technical Documents
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Die-Attach Blog Posts
Indium Corporation’s gold/tin solder paste gives manufacturers the versatility to produce high volumes of scaled-up product on demand without committing to component designs that would limit further research and development.
We’re featuring our Au solder product line and braze materials at the High-Temperature Electronics Network (HiTEN 2019) at St. Anne’s College in Oxford, UK.
Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.