Indium Corporation's Die-Attach Wire (or SSDA [soft solder die-attach] wire) is a fluxless solder wire used to effect die-attach. SSDA grade wire will result in higher yields of an improved quality product with fewer interruptions in production.
Key Performance Needs
- Ultralow oxide (wire surface and in wire)
- High alloy purity
- Precise and consistent wire diameter
- Tight alloy chemistry control
Die-Attach Wire Technical Documents
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Safety Data Sheets
Die-Attach Blog Posts
Indium Corporation’s gold/tin solder paste gives manufacturers the versatility to produce high volumes of scaled-up product on demand without committing to component designs that would limit further research and development.
We’re featuring our Au solder product line and braze materials at the High-Temperature Electronics Network (HiTEN 2019) at St. Anne’s College in Oxford, UK.
Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.