Jetting (Microdispense) Solder Paste
Jetting or microdispense solder pastes include no-clean and water-soluble solder pastes, and are used with SnAgCu and SnPb alloy systems. These pastes are designed for microdispense and jetting applications. Jetting pastes are compatible with their corresponding printable solder pastes, as identified in the table below. It is important that they ONLY be used with the matched printable solder pastes.
These products are designed for reflow in air or nitrogen atmosphere of 100ppm oxygen or less. Jetting solder pastes are specifically formulated for fine-pitch and ultra-fine dispensing for various applications as well as giving reliable dispensing of a consistent size deposit in automated dispensing or jetting equipment.
All Jetting Pastes use Type 6SG powder size.
Jetting (Microdispense) Solder Paste:
|Paste Name||Description||Alloy||Compatible Printer Solder Paste|
|MD101||No-clean SAC solder paste||SAC305||Indium10.1|
|MD089||No-clean SAC solder paste||SAC305||Indium8.9|
|MD089HF||No-clean SAC solder paste||SAC305||Indium8.9HF|
|MD092H||No-clean SnPb solder paste||Sn63||NC-SMQ92J|
|MD064R||Water-soluble SAC solder paste||SAC305||Indium6.4R|
|MD064R||Water-soluble SnPb solder paste||Sn63||Indium6.4R|
Jetting (Microdispense) Solder Pastes Technical Documents
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Product Data Sheets
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