No-Clean Pb-Free Solder Pastes
No-Clean Pb-Free Solder Paste
As a leader in soldering technology, Indium Corporation offers a number of solder pastes for Pb-free assembly. We offer many different alloy choices and flux technologies to solve many of your process challenges.
Indium Corporation’s Pb-free solder pastes are ideal for miniaturized components and fine-pitch assembly. They provide first-class printing and robust reflow performance and are all designed to AVOID THE VOID®.
|Product Name||Value Proposition|
|Indium8.9HF||Best all-around halogen-free paste|
|Indium10.1HF||Ultra-low voiding in air reflow|
|Indium8.9HF-1||Enables in-circuit probe testing|
|Indium8.9HFA||Superior printing for miniaturization|
|Indium10.1||Best all-around halogen-containing solder paste|
|Indium10.8HF||Addresses non-wet opens (NWOs)|
|Indium8.9||Eliminates head-in-pillow (HiP)|
|Indium11.8HF-SPR||Specifically for mobile phone assemblies|
As a leader in soldering technology, Indium Corporation has a variety of tried and true solder pastes for Pb-free circuit board assembly. Here are some additional solder pastes designed to help you with many of your soldering challenges.
|Product Name||Value Proposition||SDS|
|NC-SMQ230||A SAC solder paste with consistent repeatable printing performance combined with long stencil and tack times|
|Indium10.2HF||A halogen-free SAC solder paste with excellent resistance to head-in-pillow (HIP) and non-wet opens (NWO) and unprecedented stencil print transfer efficiency|
|Indium5.8LS||A halogen-free SAC solder paste designed for maximum print transfer efficiency and elimination of flux spattering|
|Indium5.7LT||A BiSn low melting solder paste with high reliability for use in temperature sensitive applications|
|NC-SMQ80||An InSn solder paste specially designed for low temperature applications that need high mechanical reliability|
Solder Paste Videos
Avoid the Void®: An Introduction to Indium10.1HF Solder Paste
Why Solder Paste is Not a Commodity: Properties that Make a Superior Solder Paste
Printing Differences Between No-Clean and Water-Soluble Solder Pastes
Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void®
Voiding: Causes & Mitigation
Avoid the Void®: Indium8.9HF Solder Paste with Andreas Karch
Related Markets and Applications
No-Clean Pb-Free Solder Paste Technical Documents
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Product Data Sheets
Safety Data Sheets
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Solder Paste Blog Posts
Low temperature Durafuse™ LT's drop-shock test is two orders of magnitude better than the drop shock test of a BiSnAg alloy.
The different flux and solder paste formulations mean that some products will have different material lifetimes than others. Understanding the lifetimes and following manufacturers recommendations can help to ensure you get the optimum performance from the material.
Indium Corporation's new high reliability solder alloy Indalloy® 292 is focused on exceeding the thermal cycling requirements for automotive applications.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.