Package-on-package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and then placing the logic chip into the paste. The memory package is then dipped into a PoP solder paste or flux, placed on top of the logic chip, and then reflowed. This is generally a no-clean process.
|PoP Paste 9.91||Eliminates defects due to package warping; is suitable for use down to 0.3mm pitch|
|PoP Paste 9.88||Designed for use with SAC305; suitable for use down to 0.4mm pitch|
|PoP Flux 8.9HF-LV||Designed for Pb-free solders; has unique halogen-free activator system|
|PoP Flux 89-LV||Excellent solderability to Cu-OSP, AuNi, and Ag finishes; optimized for SAC applications|
|PoP Flux 89LV-B||A blue/black version of Indium89LV|
|PoP Flux 89LV-P||A pink version of Indium89LV|
|PoP Flux 23LV||A clear, non-brittle residue with an extended pot life; ideal for packages up to 25mm x 25mm|
Related Markets and Applications
Package-on-Package Paste Technical Documents
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Safety Data Sheets
Package-on-Package Blog Posts
We’re featuring our Au solder product line and braze materials at the High-Temperature Electronics Network (HiTEN 2019) at St. Anne’s College in Oxford, UK.
Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?
Visit us at SPIE West show at booth #3310 on February 5-7. We look forward to learning more about your applications.
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