好了，您已進入封裝組裝的最後階段。只需按照焊料製造商（希望是我們！）建議的回流焊規範進行加熱即可。如果元件可能會接觸到回流爐上的簾幕，則應在元件上方放置一個籠子。除此之外，回流焊就非常簡單了。使用焊膏組裝封裝元件幾乎總會比使用球狀附件助焊劑造成更多的空洞，但這是增加焊接量的折衷。
Professor Patty Coleman was in her office at Ivy University contemplating a truism. Both she and her husband Rob worked at Ivy U, but they couldn’t afford to send their twin sons
Ivy University Professor Patty Coleman was at Simon Pearce Restaurant, having a solo lunch and relaxing as she watched the beautiful waterfall at the restaurant. As she enjoyed their signature
When it comes to electronics reliability, surface insulation resistance (SIR) testing is one of the most important, yet often overlooked, safeguards. Failures in SIR can lead to mission losses,
