模具下不可接受的空洞
功率晶片下方的空隙越少，就能透過焊料將更多熱量散佈到基板、散熱片或導線架上。減少裸片下方的空隙不僅是為了獲得最大的焊點強度，也是為了獲得足夠的熱傳導所必須的。有幾種技巧可以減少空洞，尤其是在使用焊膏時。其中一個最有效的方法就是反覆剖析。
But what is acceptable voiding? Some die-attach processes limit voiding to 25% of the solder area under the die – although many people accept nothing more than 10%. With proper profiling and a good solder paste, voiding can be limited to <5% in almost any application.
Professor Patty Coleman was in her office at Ivy University contemplating a truism. Both she and her husband Rob worked at Ivy U, but they couldn’t afford to send their twin sons
Ivy University Professor Patty Coleman was at Simon Pearce Restaurant, having a solo lunch and relaxing as she watched the beautiful waterfall at the restaurant. As she enjoyed their signature
When it comes to electronics reliability, surface insulation resistance (SIR) testing is one of the most important, yet often overlooked, safeguards. Failures in SIR can lead to mission losses,
