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Video Library

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Interviews

Indium Corporation’s Innovations For the Factory Floor Pt. 2: Indium Tri-Chloride Type H

Indium Corporation’s Innovations For the Factory Floor Pt. 2: Indium Tri-Chloride Type H

IIndium Corporation’s Innovations For the Factory Floor Pt. 1: EZ-Pour®

Indium Corporation’s Innovations For the Factory Floor Pt. 1: EZ-Pour®

LEDs Everywhere: How Indium Factors into LED Manufacturing

Electronics Assembly Process Challenges with Miniaturization

LEDs Everywhere: How Indium Factors into LED Manufacturing

LEDs Everywhere: How Indium Factors into LED Manufacturing

Test Methods for ECM Assessment & Process Control: Basics of ECM

Test Methods for ECM Assessment & Process Control: Basics of ECM

Test Methods for ECM Assessment & Process Control: Sources of Contamination

Test Methods for ECM Assessment & Process Control: Sources of Contamination

Test Methods for ECM Assessment & Process Control: Test Methodologies & Process Control

Test Methods for ECM Assessment & Process Control: Test Methodologies & Process Control

Test Methods for ECM Assessment & Process: Process Considerations for Flux Reliability

Test Methods for ECM Assessment & Process: Process Considerations for Flux Reliability

Exploring the Wet Gold Technique to Measure Precious Metal Content

Exploring the Wet Gold Technique to Measure Precious Metal Content

Calculating Confidence Intervals of Cpk in Stencil Printing

Calculating Confidence Intervals of Cpk in Stencil Printing

Maximizing Uptime in Electronics Assembly

Maximizing Uptime in Electronics Assembly

The Correct Formula for Solder Alloy Density

The Correct Formula for Solder Alloy Density

Calculating Oddly Shaped Aperture Area Ratios

Calculating Oddly Shaped Aperture Area Ratios

The Ultimate Electrical Reliability Challenge

Autonomous Automobiles: The Ultimate Electrical Reliability Challenge

Tech Services in Electronics Assembly

The Importance of Tech Services in Electronics Assembly

Properties that Make a Superior Solder Paste

Why Solder Paste is Not a Commodity: Properties that Make a Superior Solder Paste

The Transition to Lead-Free Electronics Assembly

RoHS Ten Years Later: The Transition to Lead-Free Electronics Assembly

Thayer School of Engineering at Dartmouth

150 Year Anniversary of the Thayer School of Engineering at Dartmouth

Ed Briggs Interview

This video is for people deciding between no clean and water-soluble solder paste technologies or who are considering cleaning a no-clean.

Carol Gowans Interview

This video is for people who are interested in working with indium solder alloys and cryogenic sealing alloys.

Abundant Indium

Abundant Indium

Water Souluble vs. No Clean Technology

Water Souluble vs. No Clean Technology

Design Solutions for Engineered Solders

Design Solutions for Engineered Solders

Electrical, Thermal, and Mechanical Reliability of Electronics Assembly

Electrical, Thermal, and Mechanical Reliability of Electronics Assembly

Reflow Profiling

Reflow Profiling

Causes and solutions to voiding in die-attach

Causes and solutions to voiding in die-attach

IPC APEX EXPO 2014: Tim Jensen Discusses Solder Fortification®

IPC APEX EXPO 2014: Tim Jensen Discusses Solder Fortification®

IPC APEX EXPO 2014: The Demise of Flux has Been Greatly Exaggerated

IPC APEX EXPO 2014: The Demise of Flux has Been Greatly Exaggerated

IPC APEX EXPO 2014: Major Changes in the Past 80 Years

IPC APEX EXPO 2014: Major Changes in the Past 80 Years

IPC APEX EXPO 2014: Indium Listens to Customer's Needs

IPC APEX EXPO 2014: Indium Listens to Customer's Needs

IPC APEX EXPO 2014: Indium Celebrates 80th Anniversary

IPC APEX EXPO 2014: Indium Celebrates 80th Anniversary

IPC APEX EXPO 2014: Dr. Ning-Cheng Lee Wins Award for APEX Paper

IPC APEX EXPO 2014: Dr. Ning-Cheng Lee Wins Award for APEX Paper

IPC APEX EXPO 2013: SACm®: Better Drop Test Performance by Indium

IPC APEX EXPO 2013: SACm®: Better Drop Test Performance by Indium

IPC APEX EXPO 2013: Dr. Ron Lasky's Lead-Free Check-up Results

IPC APEX EXPO 2013: Dr. Ron Lasky's Lead-Free Check-up Results

From One Engineer to Another®

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