Video Library
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.
Indium Corporation — ©1996–2019. All Rights Reserved. | Site Map | Privacy Policies
Indium Corporation uses cookies to provide you with the best possible experience on our website. By using our website, you agree to the placement of cookies on your device.
Read more about our use of cookies here.
Browse Videos:
Interviews
Indium Corporation’s Innovations For the Factory Floor Pt. 2: Indium Tri-Chloride Type H
Indium Corporation’s Innovations For the Factory Floor Pt. 1: EZ-Pour®
Electronics Assembly Process Challenges with Miniaturization
LEDs Everywhere: How Indium Factors into LED Manufacturing
Test Methods for ECM Assessment & Process Control: Basics of ECM
Test Methods for ECM Assessment & Process Control: Sources of Contamination
Test Methods for ECM Assessment & Process Control: Test Methodologies & Process Control
Test Methods for ECM Assessment & Process: Process Considerations for Flux Reliability
Exploring the Wet Gold Technique to Measure Precious Metal Content
Calculating Confidence Intervals of Cpk in Stencil Printing
Maximizing Uptime in Electronics Assembly
The Correct Formula for Solder Alloy Density
Calculating Oddly Shaped Aperture Area Ratios
Autonomous Automobiles: The Ultimate Electrical Reliability Challenge
The Importance of Tech Services in Electronics Assembly
Why Solder Paste is Not a Commodity: Properties that Make a Superior Solder Paste
RoHS Ten Years Later: The Transition to Lead-Free Electronics Assembly
150 Year Anniversary of the Thayer School of Engineering at Dartmouth
This video is for people deciding between no clean and water-soluble solder paste technologies or who are considering cleaning a no-clean.
This video is for people who are interested in working with indium solder alloys and cryogenic sealing alloys.
Abundant Indium
Water Souluble vs. No Clean Technology
Design Solutions for Engineered Solders
Electrical, Thermal, and Mechanical Reliability of Electronics Assembly
Reflow Profiling
Causes and solutions to voiding in die-attach
IPC APEX EXPO 2014: Tim Jensen Discusses Solder Fortification®
IPC APEX EXPO 2014: The Demise of Flux has Been Greatly Exaggerated
IPC APEX EXPO 2014: Major Changes in the Past 80 Years
IPC APEX EXPO 2014: Indium Listens to Customer's Needs
IPC APEX EXPO 2014: Indium Celebrates 80th Anniversary
IPC APEX EXPO 2014: Dr. Ning-Cheng Lee Wins Award for APEX Paper
IPC APEX EXPO 2013: SACm®: Better Drop Test Performance by Indium
IPC APEX EXPO 2013: Dr. Ron Lasky's Lead-Free Check-up Results