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Here are three interesting things that I'm predicting will happen with indium in 2019.
In this video, Indium Corporation’s Kay Parker, Technical Support Engineer, demonstrates how to remove the release liners from HSMF thermal interface materials (TIMs)
Indium Corporation presents paper at Advanced Technology Workshop that provdes metal thermal interface materials (TIMs) have a higher insertion rate and higher thermal conductivity than traditional TIMs for burn-in and test.
From One Engineer to Another®
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